GS81302Q18AGD-300I

Memory IC Overview

The GS81302Q18AGD-300I is a 144 Mbit Quad Data Rate (QDR) II static random-access memory (SRAM) manufactured by GSI Technology. It features an 8 M x 18 organization with a maximum clock frequency of 300 MHz and operates on a parallel interface. The device supports a supply voltage range of 1.7 V to 1.9 V, with a maximum power current of 860 mA. It is housed in a 165-ball BGA package suitable for surface mount technology. The component is rated for industrial operating temperatures between -40°C and +100°C.

Memory IC Feature Summary

• Supports simultaneous read and write operations through dedicated address and data buses
• Provides high-bandwidth data transfer via synchronous quad-port architecture
• Includes integrated clock inputs for precise timing synchronization

Memory IC Applications

• High-speed networking equipment requiring low-latency packet buffering
• Telecommunications infrastructure utilizing synchronous data processing
• Industrial control systems demanding wide temperature stability

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +100°C). Confirm the 'GD' designation matches the required 165-ball BGA footprint and pinout. Ensure the '300' speed bin aligns with system timing requirements. Check RoHS compliance status against current regulatory standards before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 144 Mbit capacity with an 18-bit word width is required. Choose this part over other organizations if the application demands 8M depth. Verify that the 300 MHz speed rating meets the system's throughput needs. Ensure the design accommodates the 1.7V to 1.9V power supply constraints and thermal management for the specified current draw.

Memory IC Part Context

This SRAM belongs to the SigmaQuad-II family, designed for applications needing fast, synchronous memory access. It utilizes QDR technology to allow concurrent read and write cycles without bus contention. The device is part of a broader portfolio offering various speeds and organizations within the same physical package form factor.

Memory IC Replacement Considerations

Check for compatible parts within the GS81302 series that share the same 165-ball BGA footprint. Verify electrical compatibility regarding voltage levels and signal integrity. Ensure any substitute maintains the 18-bit data width and similar latency characteristics.