GS81302Q18GE-300I

Memory IC Overview

The GS81302Q18GE-300I is a 144 Mbit Quad Data Rate II (QDR-II) synchronous static random-access memory manufactured by GSI Technology. It features an organization of 8 Megawords by 18 bits and supports a maximum clock frequency of 300 MHz via a parallel interface. The device operates within a supply voltage range of 1.7 V to 1.9 V, with a maximum power current of 1.26 A. It is housed in a 165-ball BGA package suitable for surface mount technology and functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports four data beats per clock cycle for high-bandwidth throughput
• Includes dedicated command and address buses for independent control
• Features on-die termination for signal integrity optimization

Memory IC Applications

• High-speed networking equipment
• Telecommunications infrastructure
• Data center storage systems

Memory IC Procurement Notes

Verify the specific suffix 'GE' against official manufacturer documentation to confirm lead-free status and RoHS compliance details. Ensure the ordering part number matches the exact speed grade and package variant required for your design. Cross-reference the datasheet revision date to confirm all electrical specifications are current before finalizing procurement orders.

Memory IC Selection Notes

Select this component when designing systems requiring high bandwidth and low latency memory solutions. The QDR-II architecture is ideal for applications needing simultaneous read and write operations without bus contention. Consider the 18-bit width for error correction code implementations if system requirements demand enhanced data reliability during high-speed transfers.

Memory IC Part Context

This part belongs to the SigmaQuad-II family of synchronous SRAMs designed for high-performance embedded applications. The series offers scalable density options while maintaining consistent pinouts and timing characteristics across different configurations. It represents a specialized solution for bandwidth-intensive tasks where traditional DDR or SDRAM architectures may introduce bottlenecks.

Memory IC Replacement Considerations

Consult official substitution guides for compatible parts within the same family. Verify that any alternative maintains identical pinout compatibility and timing parameters to ensure seamless integration without redesigning the host circuit board.