Memory IC GS81302Q36AGD-300I product image

GS81302Q36AGD-300I

$194.26
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:706fd1d5620c Category: Brand:

  
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GS81302Q36AGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81302Q36AGD-300I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR II
  • Memory Size:144Mbit
  • Memory Organization:4M x 36
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS81302Q36AGD-300I

GS81302Q36AGD-300I

Memory IC Overview

The GS81302Q36AGD-300I is a SigmaQuad-II static random access memory (SRAM) manufactured by GSI Technology. It features a storage capacity of 144 Mbit organized as 4 M x 36 bits. The device supports a maximum clock frequency of 300 MHz with a parallel interface. Operating voltage ranges from 1.7 V to 1.9 V, with a maximum power current of 970 mA. It operates within an industrial temperature range of -40°C to +100°C and is housed in a BGA-165 surface-mount package.

Memory IC Feature Summary

  • SigmaQuad-II architecture providing quad data rate performance for high-speed applications
  • Industrial temperature rating ensuring reliable operation in extreme environments
  • Parallel interface supporting wide data bus configurations for efficient throughput

Memory IC Applications

  • High-performance networking equipment requiring low-latency buffering
  • Telecommunications infrastructure utilizing industrial-grade components
  • Data acquisition systems demanding fast parallel data access

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +100°C) against the official datasheet. Confirm the BGA-165 package dimensions and pinout match the design requirements. Ensure the 300 MHz speed grade aligns with system timing constraints. Check RoHS compliance status through the manufacturer's documentation before finalizing procurement.

Memory IC Selection Notes

Select this component when a 144 Mbit capacity with a 36-bit width is required for parallel processing. The industrial temperature range makes it suitable for harsh environments where commercial grades fail. Compare power consumption at 970 mA against system thermal limits. Ensure the BGA-165 footprint is compatible with the PCB layout and assembly capabilities.

Memory IC Part Context

This part belongs to the GS81302Q36AGD series of SigmaQuad-II SRAMs. It shares the same core architecture and pinout with other variants in the family, differing primarily in speed grade and temperature rating. The QDR-II technology enables simultaneous read and write operations, distinguishing it from traditional single-port or dual-port SRAMs.

Memory IC FAQ

What is the specific organization of the memory array?

The memory array is organized as 4 Megwords by 36 bits.

Does this component support simultaneous read and write operations?

Yes, the SigmaQuad-II architecture allows for independent read and write ports, enabling simultaneous operations.

GS81302Q36AGD-300IGS81302Q36AGD-300I
$194.26
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