Memory IC GS81302Q36GE-300I product image

GS81302Q36GE-300I

$194.26
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:16f0a90a9fa0 Category: Brand:

  
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GS81302Q36GE-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81302Q36GE-300I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:144Mbit
  • Memory Organization:4M x 36
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x17)
  • Access Time:-

Memory IC datasheet and documents for GS81302Q36GE-300I

GS81302Q36GE-300I

Memory IC Overview

The GS81302Q36GE-300I is a 144 Mbit Quad Data Rate II (QDR-II) static random-access memory manufactured by GSI Technology. It features a 4 M x 36 organization with a maximum clock frequency of 300 MHz and parallel interface. The device operates within a supply voltage range of 1.7 V to 1.9 V, with a maximum power current of 1.13 A. It supports an industrial temperature range from -40°C to +85°C and is housed in a 165-ball BGA package.

Memory IC Feature Summary

  • Supports QDR-II architecture for high-speed data transfer
  • Provides 144 Mbit storage capacity in a compact BGA form factor
  • Operates at frequencies up to 300 MHz for demanding applications

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure
  • Data center storage systems

Memory IC Procurement Notes

Verify the specific suffix 'GE' indicates the correct voltage and temperature grade against your system requirements. Confirm the 300 MHz speed bin matches your design timing constraints. Ensure the BGA-165 footprint aligns with your PCB layout. Check RoHS compliance status if required by your manufacturing standards.

Memory IC Selection Notes

Select this component when a 4 M x 36 configuration is required for wide-data bus applications. The 300 MHz speed grade offers higher throughput than lower-frequency variants. The industrial temperature rating (-40°C to +85°C) ensures reliability in harsh environments compared to commercial grades.

Memory IC Part Context

This part belongs to the SigmaQuad-II family of QDR SRAMs from GSI Technology. It shares the same physical package and basic interface as other members of the series but differs in speed grade and organizational width. The 'Q36' designation specifies the 36-bit word width, distinguishing it from narrower or wider variants in the product line.

Memory IC Replacement Considerations

Direct replacements include other GS81302Q36 variants with compatible speed grades such as GS81302Q36GE-250I, provided the lower frequency meets system requirements. Verify that any substitute maintains the same 165-ball BGA package and QDR-II interface compatibility.

GS81302Q36GE-300IGS81302Q36GE-300I
$194.26
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