ChipApex | Global Electronic Components Supplier
SEARCH
Search Product
Search Post
— IC芯片 | 连接器 | 传感器 | 被动器件 —
Consult the customer manager about the wholesale price.
consultation hotline：86-132-6715-2157
email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.
Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.
GS81302QT19GE-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.
Memory IC specifications for GS81302QT19GE-300I
- Description：IC SRAM 144MBIT PAR 165FPBGA
- Series：-
- Mfr：GSI Technology Inc.
- Package：Tray
- Memory Type：Volatile
- Memory Format：SRAM
- Technology：SRAM - Quad Port, Synchronous
- Memory Size：144Mbit
- Memory Organization：8M x 18
- Memory Interface：Parallel
- Clock Frequency：300 MHz
- Write Cycle Time - Word, Page：-
- Voltage - Supply：1.7V ~ 1.9V
- Operating Temperature：-40°C ~ 100°C (TJ)
- Mounting Type：Surface Mount
- Package / Case：165-LBGA
- Supplier Device Package：165-FPBGA (15x17)
- Access Time：-
Memory IC datasheet and documents for GS81302QT19GE-300I
Memory IC Overview
The GS81302QT19GE-300I is a static random-access memory component manufactured by GSI Technology. It features a storage capacity of 144 Mbit organized as 8 M x 18 bits. The device supports a maximum clock frequency of 300 MHz with an access time of 450 ps. It utilizes a parallel interface and operates within a power supply voltage range of 1.7 V to 1.9 V, drawing a maximum current of 1.26 A. The unit is housed in a BGA-165 package suitable for surface mount technology and functions reliably across an operating temperature range from -40°C to +85°C.
Memory IC Feature Summary
- Implements SigmaQuad-II+ architecture for high-speed data handling
- Supports QDR-II storage type for efficient parallel processing
- Designed for industrial-grade environmental stability
Memory IC Applications
- High-performance networking equipment
- Telecommunications infrastructure systems
- Industrial control applications requiring fast memory access
Memory IC Procurement Notes
Verify the specific part number against official manufacturer documentation to ensure compatibility with system requirements. Confirm that the BGA-165 package dimensions and pinout align with the printed circuit board layout. Check humidity sensitivity levels and reflow soldering profiles during assembly planning. Ensure power delivery networks support the specified voltage range and peak current demands under full load conditions.
Memory IC Selection Notes
Select this component when a 144 Mbit capacity with 18-bit word width is required for parallel data paths. The 300 MHz speed rating suits applications needing rapid data throughput without excessive latency. Consider the wide industrial temperature range if the deployment environment experiences significant thermal fluctuations. Evaluate the BGA-165 footprint constraints against available board space before finalizing the design.
Memory IC Part Context
This device belongs to the GS81302QT19GE series, which represents GSI Technology's portfolio of high-speed SRAM solutions. The series is characterized by its integration of advanced pipeline architectures to maximize bandwidth. These components are engineered to meet the rigorous timing and reliability standards demanded by modern digital signal processing and communication systems.
Memory IC FAQ
What is the specific storage organization of this SRAM?
The memory is organized as 8 Megawords by 18 bits, totaling 144 Mbit.
Does this component support dual data rate operations?
No, it utilizes Quad Data Rate (QDR-II) technology rather than DDR architecture.
Explore related parts through Memory, Integrated Circuits (ICs), all product categories, ChipApex homepage.
