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GS81302QT37GE-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.
The GS81302QT37GE-300I is a 144 Mbit QDR-II+ synchronous static RAM manufactured by GSI Technology. It features a 4M x 36 organization and supports a maximum clock frequency of 300 MHz with a parallel interface. The device operates within a supply voltage range of 1.7 V to 1.9 V and includes an integrated PLL for clock generation. It is housed in a BGA-165 package, designed for surface mount technology, and supports industrial temperature ranges.
Verify the specific suffix codes against official manufacturer documentation to confirm temperature grade and packaging variations. Ensure compatibility with existing PCB footprints for the BGA-165 package. Confirm moisture sensitivity levels and reflow soldering profiles prior to assembly. Cross-reference ordering information directly with authorized distributors to avoid counterfeit components.
Select this component when system requirements demand high bandwidth and low latency for buffer applications. Compare against standard SRAMs if power consumption is critical, as QDR devices offer higher throughput at similar power levels. Evaluate board space constraints due to the BGA-165 footprint. Consider thermal management solutions suitable for the specified operating temperature range.
This part belongs to the GS81302 family of QDR-II+ memories from GSI Technology. These devices are engineered for applications requiring substantial data throughput without complex arbitration logic. The family utilizes advanced CMOS technology to balance performance with power efficiency, serving as a key solution for high-speed data path architectures in modern electronic systems.
Direct replacements include other GS81302 variants with compatible pinouts and electrical characteristics. Verify that substitute parts match the required clock speed and memory organization. Check for equivalent package dimensions and thermal properties to ensure mechanical fit.
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