Memory IC GS81302T18GE-350I product image

GS81302T18GE-350I

$176.95
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:abcd029bcede Category: Brand:

  
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GS81302T18GE-350I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81302T18GE-350I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, DDR II
  • Memory Size:144Mbit
  • Memory Organization:8M x 18
  • Memory Interface:Parallel
  • Clock Frequency:350 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x17)
  • Access Time:-

Memory IC datasheet and documents for GS81302T18GE-350I

GS81302T18GE-350I

Memory IC Overview

The GS81302T18GE-350I is a high-performance Double Data Rate Static Random Access Memory (DDR SRAM) manufactured by GSI Technology. It features a total storage capacity of 144 Mbit, organized as 8 Megawords by 18 bits. The device supports a maximum clock frequency of 350 MHz and operates within a voltage range of 1.7 V to 1.9 V. It utilizes a parallel interface and is housed in a 165-ball BGA package suitable for surface mount technology. The component is designed for industrial temperature ranges from -40°C to +85°C.

Memory IC Feature Summary

  • Supports double data rate operation for enhanced throughput
  • Integrates pipelined architecture for efficient data handling
  • Provides robust error correction capabilities via built-in ECC

Memory IC Applications

  • High-speed networking equipment
  • Telecommunications infrastructure systems
  • Industrial automation control units

Memory IC Procurement Notes

Verify the specific suffix codes against official manufacturer documentation to ensure compatibility with required voltage levels and temperature ratings. Confirm that the 165-ball BGA footprint matches the target PCB design constraints. Ensure compliance with relevant environmental standards such as RoHS before finalizing procurement orders.

Memory IC Selection Notes

Select this component when designing systems requiring high bandwidth memory solutions with low power consumption. The 18-bit organization including ECC bits makes it suitable for applications demanding high data integrity. Consider the 350 MHz speed grade if system timing requirements exceed standard SRAM capabilities.

Memory IC Part Context

This part belongs to the GS81302 series of DDR SRAMs from GSI Technology. The series is characterized by its use of SigmaDDR-II+ technology, which combines the density of DRAM with the speed and ease of use of SRAM. These components are widely used in embedded systems where performance and reliability are critical.

Memory IC Replacement Considerations

Check for direct substitutes within the same GS81302 family with different speed grades or organizational variants. Verify pin-to-pin compatibility with alternative packages if space constraints change.

GS81302T18GE-350IGS81302T18GE-350I
$176.95
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