Memory IC GS81302T36GE-350I product image

GS81302T36GE-350I

$176.95
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:2567c4d40c7d Category: Brand:

  
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GS81302T36GE-350I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81302T36GE-350I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, DDR II
  • Memory Size:144Mbit
  • Memory Organization:4M x 36
  • Memory Interface:Parallel
  • Clock Frequency:350 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x17)
  • Access Time:-

Memory IC datasheet and documents for GS81302T36GE-350I

GS81302T36GE-350I

Memory IC Overview

The GS81302T36GE-350I is a static random access memory device manufactured by GSI Technology. It features a storage capacity of 144 Mbit organized as 4 M x 36 bits. The component supports a maximum clock frequency of 350 MHz with a parallel interface type. Operating voltage ranges from a minimum of 1.7 V to a maximum of 1.9 V, with a maximum power current of 1.065 A. It operates within a temperature range of -40 C to +85 C and utilizes a BGA-165 surface mount package.

Memory IC Feature Summary

  • Supports high-speed data transfer at frequencies up to 350 MHz
  • Provides 144 Mbit storage capacity in a 4 M x 36 organization
  • Operates on a single low-voltage power supply between 1.7 V and 1.9 V
  • Designed for industrial temperature environments ranging from -40 C to +85 C

Memory IC Applications

  • High-performance networking equipment requiring fast memory access
  • Telecommunications infrastructure systems
  • Industrial control systems operating in extreme temperatures
  • Data acquisition systems needing wide bandwidth

Memory IC Procurement Notes

Verify the exact part number against official manufacturer documentation before procurement. Confirm that the suffix indicates the correct temperature grade and package variant. Ensure compatibility with system voltage requirements of 1.7 V to 1.9 V. Check for moisture sensitivity levels if the component has been stored improperly. Validate pinout configurations against the specific PCB design layout.

Memory IC Selection Notes

Select this component when a 350 MHz synchronous SRAM is required for 36-bit wide data paths. Consider the BGA-165 package constraints for board space and thermal management. Evaluate power consumption limits given the 1.065 A maximum current draw. Ensure the application environment stays within the specified -40 C to +85 C operational range. Compare against other SigmaDDR-II series parts for potential cost or performance optimizations.

Memory IC Part Context

This part belongs to the GS81302 family of high-speed SRAMs from GSI Technology. It is part of the SigmaDDR-II product line designed for demanding applications. The family includes various organizations and speed grades sharing similar architectural features. Other variants may differ in bit width, clock speed, or temperature ratings while maintaining the same core technology.

Memory IC Replacement Considerations

Check for direct substitutes within the GS81302 series such as the GS81302T36E-350I. Verify if lower speed grades like 300 MHz variants are acceptable for the design. Ensure any replacement maintains the 4 M x 36 organization and BGA-165 footprint. Confirm that voltage and current specifications match the existing power delivery network.

GS81302T36GE-350IGS81302T36GE-350I
$176.95
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