Memory IC GS81302TT20GE-500I product image

GS81302TT20GE-500I

$194.26
  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:40f8b81d1c48 Category: Brand:

  
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GS81302TT20GE-500I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81302TT20GE-500I

  • Description:IC SRAM 144MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:144Mbit
  • Memory Organization:8M x 18
  • Memory Interface:Parallel
  • Clock Frequency:500 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x17)
  • Access Time:-

Memory IC datasheet and documents for GS81302TT20GE-500I

GS81302TT20GE-500I

Memory IC Overview

The GS81302TT20GE-500I is a high-performance Static Random Access Memory (SRAM) device manufactured by GSI Technology. It belongs to the SigmaDDR-II+ family and features a storage capacity of 144 Mbit organized as 8 Megawords by 18 bits. The component supports a maximum clock frequency of 500 MHz with a parallel interface. It operates within a voltage range of 1.7 V to 1.9 V, drawing a maximum current of 740 mA. The device is housed in a BGA-165 package suitable for surface mount technology and functions reliably across an industrial temperature range from -40°C to +100°C.

Memory IC Feature Summary

  • Implements SigmaDDR-II+ architecture for high-speed data transfer
  • Supports dual-data-rate synchronous operation via parallel interface
  • Designed for low-voltage power supply requirements

Memory IC Applications

  • High-speed networking equipment
  • Telecommunications infrastructure systems
  • Industrial control applications requiring wide temperature tolerance

Memory IC Procurement Notes

Verify the specific suffix codes against official manufacturer documentation to ensure correct speed grade and temperature rating compatibility. Confirm that the BGA-165 footprint matches your PCB design constraints. Check for moisture sensitivity levels and reflow soldering profile requirements prior to assembly. Ensure supply chain sources provide genuine components with traceable manufacturing dates.

Memory IC Selection Notes

Select this component when system designs require 144 Mbit density with 500 MHz throughput capabilities. Consider the 1.8V nominal operating voltage for power budget calculations. Evaluate the BGA-165 package size against available board real estate. Compare thermal performance characteristics against the specified 100°C maximum junction temperature limit for your enclosure environment.

Memory IC Part Context

This part is part of the GS81302 series of DDR SRAMs from GSI Technology. It shares architectural similarities with other members like the GS81302DT20E-500I but differs in interface type and speed grade. The series targets bandwidth-intensive applications where latency and throughput are critical performance metrics.

Memory IC Replacement Considerations

Consult official substitution guides for compatible alternatives within the same product family. Verify pinout and electrical parameter compatibility before replacing existing inventory.

GS81302TT20GE-500IGS81302TT20GE-500I
$194.26
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