Memory IC GS81313LD36GK-625I product image

GS81313LD36GK-625I

$359.83
  • Description:IC SRAM 144MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:512680bd5150 Category: Brand:

  
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GS81313LD36GK-625I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 260BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81313LD36GK-625I

  • Description:IC SRAM 144MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:144Mbit
  • Memory Organization:4M x 36
  • Memory Interface:Parallel
  • Clock Frequency:625 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.2V ~ 1.35V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:260-BGA
  • Supplier Device Package:260-BGA (22x14)
  • Access Time:-

Memory IC datasheet and documents for GS81313LD36GK-625I

GS81313LD36GK-625I

Memory IC Overview

The GS81313LD36GK-625I is a static random access memory component manufactured by GSI Technology. It features a storage capacity of 144 Mbit organized as 4M x 36 bits. The device supports a maximum clock frequency of 625 MHz with a parallel interface. Operating voltage ranges from 1.2 V to 1.35 V, with a maximum power current of 1.5 A. It functions within a temperature range of 0°C to +85°C and utilizes a BGA-260 surface-mount package.

Memory IC Feature Summary

  • Supports high-speed data transfer via parallel DDR interface architecture
  • Operates on low-voltage power supply specifications for energy efficiency
  • Designed for robust performance in commercial industrial temperature environments

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure systems
  • Industrial control processing units

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm exact speed grade and environmental rating. Ensure compatibility with existing board layouts regarding the BGA-260 footprint and pin configuration. Confirm moisture sensitivity level requirements for your assembly process before procurement.

Memory IC Selection Notes

Select this component when a 144 Mbit density with 36-bit width is required for parallel data paths. Consider the 625 MHz operational limit relative to system clock constraints. Evaluate thermal management needs given the specified operating temperature range and power consumption characteristics at maximum frequency.

Memory IC Part Context

This part belongs to the GS81313 series of SRAM devices from GSI Technology. These components are engineered for applications demanding high bandwidth and low latency. The series typically integrates advanced DDR technologies to meet stringent timing requirements in modern electronic systems.

Memory IC Replacement Considerations

Consult official substitution lists for compatible parts within the same family or equivalent offerings from other manufacturers. Verify electrical parameters and pinout compatibility before considering alternative sources.

GS81313LD36GK-625IGS81313LD36GK-625I
$359.83
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