Memory IC GS81313LQ18GK-800I product image

GS81313LQ18GK-800I

$430.16
  • Description:IC SRAM 144MBIT PARALLEL 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:ed89240e18b1 Category: Brand:

  
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GS81313LQ18GK-800I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PARALLEL 260BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81313LQ18GK-800I

  • Description:IC SRAM 144MBIT PARALLEL 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR IIIe
  • Memory Size:144Mbit
  • Memory Organization:8M x 18
  • Memory Interface:Parallel
  • Clock Frequency:800 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.2V ~ 1.35V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:260-BGA
  • Supplier Device Package:260-BGA (22x14)
  • Access Time:-

Memory IC datasheet and documents for GS81313LQ18GK-800I

GS81313LQ18GK-800I

Memory IC Overview

The GS81313LQ18GK-800I is a synchronous Quad Port Dynamic RAM (QDR) memory IC from the SigmaQuad-IIIe family. It provides a total storage capacity of 144 Mbit, organized as 8 Megawords by 18 bits. The device supports a maximum clock frequency of 800 MHz and utilizes a parallel interface. It operates within a voltage range of 1.2 V to 1.25 V and is housed in a 260-pin BGA package measuring 22x14 mm. The component is rated for an industrial temperature range of -40°C to +100°C.

Memory IC Feature Summary

  • Supports simultaneous independent read and write operations across four distinct ports
  • Integrates on-chip FIFO buffers to manage data flow and reduce host processor overhead
  • Features low-voltage operation compatible with 1.2V and 1.25V power domains

Memory IC Applications

  • High-speed networking equipment requiring low-latency packet buffering
  • Telecommunications infrastructure systems
  • Industrial control systems demanding reliable synchronous memory access

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the extended industrial temperature range of -40°C to +100°C against the manufacturer datasheet. Confirm the 260-ball BGA footprint dimensions match the PCB layout requirements. Ensure supply chain sources provide genuine GSI Technology components to guarantee signal integrity at 800 MHz operation speeds.

Memory IC Selection Notes

Select this part when a design requires four independent ports for concurrent data handling without arbitration delays. Compare against the GS81313LD series if only dual-port functionality is sufficient, as the quad-port architecture increases pin count and complexity. Verify that the system power budget accommodates the peak current demands associated with high-frequency switching.

Memory IC Part Context

This component belongs to the SigmaQuad-IIIe series, representing a generation of high-performance QDR SRAMs designed for bandwidth-intensive applications. It succeeds earlier generations by offering improved power efficiency and higher clock rates while maintaining compatibility with standard parallel interfaces used in legacy and modern embedded systems.

Memory IC Replacement Considerations

Direct substitutes include other variants within the GS81313LQ18GK series with different speed grades or temperature ratings, provided the pinout remains identical.

GS81313LQ18GK-800IGS81313LQ18GK-800I
$430.16
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