Memory IC GS81313LT36GK-625I product image

GS81313LT36GK-625I

$359.83
  • Description:IC SRAM 144MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:2164d4b50504 Category: Brand:

  
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GS81313LT36GK-625I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 144MBIT PAR 260BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS81313LT36GK-625I

  • Description:IC SRAM 144MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:144Mbit
  • Memory Organization:4M x 36
  • Memory Interface:Parallel
  • Clock Frequency:625 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.2V ~ 1.35V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:260-BGA
  • Supplier Device Package:260-BGA (22x14)
  • Access Time:-

Memory IC datasheet and documents for GS81313LT36GK-625I

GS81313LT36GK-625I

Memory IC Overview

The GS81313LT36GK-625I is a 144 Mbit synchronous static random access memory (SRAM) manufactured by GSI Technology. It features a 4 M x 36 organization and operates with a maximum clock frequency of 625 MHz. The device utilizes a parallel interface and supports dual voltage operation, with a minimum supply voltage of 1.2 V and a maximum of 1.35 V. It is housed in a BGA-260 package suitable for surface mount technology. The component belongs to the SigmaDDR-IIIe series and is rated for commercial temperature ranges.

Memory IC Feature Summary

  • Supports high-speed data transfer via a parallel interface architecture
  • Operates within a specified dual-voltage range for power flexibility
  • Designed for surface mount integration using a BGA-260 package

Memory IC Applications

  • High-performance networking equipment requiring low latency memory
  • Telecommunications infrastructure systems
  • Industrial control applications demanding reliable data storage

Memory IC Procurement Notes

Verify the specific suffix designation against official manufacturer documentation to confirm exact speed grade and temperature rating specifications. Ensure compatibility with system voltage requirements before procurement. Confirm RoHS compliance status through current datasheets. Validate package dimensions against PCB footprint designs. Check for moisture sensitivity level requirements during handling and storage procedures.

Memory IC Selection Notes

Select this component when a 144 Mbit capacity with a 36-bit data width is required. The 625 MHz speed grade suits applications needing moderate-to-high bandwidth. Consider the BGA-260 package constraints for board layout. Evaluate power consumption at 1.2V versus 1.35V based on thermal design limits. Compare against other members of the GS81313 family for alternative pinouts or speeds.

Memory IC Part Context

This part belongs to the GS81313LT36GK series from GSI Technology, specifically utilizing the SigmaDDR-IIIe technology node. It is distinct from the HT and HQ variants which may offer different speed grades or temperature ranges. The LT designation typically indicates a specific performance bin within the broader SRAM portfolio designed for general-purpose high-speed memory needs.

Memory IC Replacement Considerations

Check for GS81313LT36GK-714I for higher speed requirements. Verify GS81313HT36GK-625I if industrial temperature ratings are needed instead of commercial ranges.

GS81313LT36GK-625IGS81313LT36GK-625I
$359.83
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