Memory IC GS816036DGT-333I product image

GS816036DGT-333I

$27.00
  • Description:IC SRAM 18MBIT PARALLEL 100TQFP
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:38352977490a Category: Brand:

  
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GS816036DGT-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 18MBIT PARALLEL 100TQFP. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS816036DGT-333I

  • Description:IC SRAM 18MBIT PARALLEL 100TQFP
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, Standard
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:100-LQFP
  • Supplier Device Package:100-TQFP (20x14)
  • Access Time:-

Memory IC datasheet and documents for GS816036DGT-333I

GS816036DGT-333I

Memory IC Overview

The GS816036DGT-333I is a 512K x 36, 18 Mbit Synchronous Burst Static Random Access Memory (SRAM) manufactured by GSI Technology. It operates with a maximum clock frequency of 333 MHz and features an access time of 4.5 ns. The device supports both 2.5 V and 3.3 V core and I/O power supplies, accommodating voltage ranges from 2.3 V to 3.6 V. It utilizes a parallel interface and is housed in a 100-lead TQFP package suitable for surface mount technology. The component is designed for industrial temperature applications, functioning reliably between -40°C and +100°C.

Memory IC Feature Summary

  • Supports user-configurable flow-through or pipeline operation via the FT pin
  • Features Dual Cycle Deselect (DCD) operation for enhanced control
  • Includes internal input resistors on mode pins allowing floating configurations
  • Provides automatic power-down capabilities for portable applications

Memory IC Applications

  • High-speed cache memory systems
  • Industrial embedded processing units
  • Portable electronic devices requiring low power states

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature range (-40°C to +100°C) and 3.3V/2.5V compatibility as documented. Confirm the 100-lead TQFP package type matches the target PCB footprint. Ensure the synchronous burst architecture aligns with system timing requirements. Cross-reference the manufacturer part number against official GSI Technology documentation to validate authenticity and revision status before procurement.

Memory IC Selection Notes

Select this component when a high-density 18 Mbit SRAM with 333 MHz performance is required. It is suitable for designs needing flexible pipeline or flow-through modes. Consider the dual voltage capability for systems mixing 2.5V and 3.3V logic. The industrial temperature rating makes it appropriate for harsh environments where commercial grade parts may fail.

Memory IC Part Context

This part belongs to the GS8160 series of SyncBurst SRAMs, which offers various densities and speeds. The GS816036DGT variant specifically provides a 36-bit data width. The '333' designation indicates the 333 MHz speed grade. The 'I' suffix denotes the industrial temperature extension. This series is characterized by its NBT SRAM technology and RoHS compliance.

Memory IC Replacement Considerations

GS816036DGT-400I: Higher speed grade (400 MHz). GS816036DGT-200I: Lower speed grade (200 MHz). GS8160Z36DGT-333I: ZBT variant with similar speed.

GS816036DGT-333IGS816036DGT-333I
$27.00
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