GS8160Z36DGT-333IV

Memory IC Overview

The GS8160Z36DGT-333IV is a static random-access memory component manufactured by GSI Technology. It features an 18 Mbit storage capacity organized as 512K x 36 bits. The device supports dual voltage operation at 2.5V or 3.3V and utilizes a parallel interface. Key performance metrics include a maximum clock frequency of 333 MHz and an access time of 4.5 ns. It is housed in a TQFP-100 package suitable for surface mount technology.

Memory IC Feature Summary

• Supports pipeline and flow-through architectures for flexible data handling
• Operates with 2.5V or 3.3V power supplies
• Includes JTAG-compatible boundary scan capabilities

Memory IC Applications

• High-speed cache memory systems
• Network infrastructure equipment
• Telecommunications hardware

Memory IC Procurement Notes

Verify the specific voltage variant required, as the base model number may denote 2.5V or 3.3V operation depending on the suffix. Confirm the package type matches the target PCB footprint. Ensure compliance with RoHS standards if mandated by the project specifications. Cross-reference the datasheet to validate the exact electrical characteristics for the intended operating environment.

Memory IC Selection Notes

Select this component when high-density 36-bit wide memory is required for synchronous applications. The choice between pipeline and flow-through modes should align with system latency requirements. Consider the thermal dissipation capabilities of the TQFP-100 package relative to the board layout. Verify that the controller supports the specific burst modes and deselect options defined in the technical documentation.

Memory IC Part Context

This part belongs to the GS8160 series of Zero Bus Turnaround SRAMs from GSI Technology. These devices are designed for high-performance embedded applications requiring fast data access. The series typically offers configurable operational modes to optimize bandwidth and power consumption in demanding digital signal processing and networking contexts.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers for this specific component were not identified in the available source material.