Memory IC GS816118DGD-333I product image

GS816118DGD-333I

$27.40
  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:76f7189ef7a3 Category: Brand:

  
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GS816118DGD-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 18MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS816118DGD-333I

  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, Standard
  • Memory Size:18Mbit
  • Memory Organization:1M x 18
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS816118DGD-333I

GS816118DGD-333I

Memory IC Overview

The GS816118DGD-333I is a 18 Mbit Static Random Access Memory (SRAM) manufactured by GSI Technology. It features a memory organization of 1M x 18 bits and supports a maximum clock frequency of 333 MHz with an access time of 5 ns. The device operates within a voltage range of 1.7 V to 2.7 V, drawing a maximum current of 240 mA or 300 mA depending on conditions. It utilizes a parallel interface and is housed in a BGA-165 package suitable for surface mount technology. The component functions across a temperature range from -40°C to +100°C.

Memory IC Feature Summary

  • Supports high-speed data transfer at frequencies up to 333 MHz
  • Operates with low voltage core power supplies ranging from 1.7 V to 2.7 V
  • Includes JTAG-compatible boundary scan capabilities for testing
  • Features byte write and global write operations

Memory IC Applications

  • High-performance computing systems requiring fast cache memory
  • Telecommunications infrastructure equipment
  • Network routing and switching devices
  • Industrial control systems operating in wide temperature ranges

Memory IC Procurement Notes

Verify the specific voltage variant compatibility, as datasheets indicate potential variations between 1.8/2.5V and 2.5/3.3V configurations for similar part numbers. Confirm the package type matches the design requirements, ensuring the BGA-165 footprint aligns with PCB layout specifications. Check for RoHS compliance status if environmental regulations apply to the manufacturing process. Ensure the operating temperature range meets the system's thermal constraints.

Memory IC Selection Notes

Select this component when a 1M x 18 bit SRAM configuration is required for parallel data interfaces. Consider the 333 MHz speed grade for applications demanding low latency and high throughput. Evaluate the power consumption characteristics against system thermal management capabilities. Verify that the BGA-165 package is compatible with available assembly equipment and design rules.

Memory IC Part Context

This part belongs to the GS8161 series of SyncBurst SRAMs produced by GSI Technology. These devices are designed for high-speed memory applications using standard CMOS technology. The series typically offers various speed grades and voltage options to suit different system requirements while maintaining pin compatibility within families.

Memory IC Replacement Considerations

Check for direct substitutes within the GS8161 family such as GS816118DGT-333I for TQFP packaging alternatives. Verify electrical parameters match exactly before substitution.

GS816118DGD-333IGS816118DGD-333I
$27.40
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