Memory IC GS8182D36BGD-300I product image

GS8182D36BGD-300I

$21.34
  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:d6c0e4a0f765 Category: Brand:

  
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GS8182D36BGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 18MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8182D36BGD-300I

  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8182D36BGD-300I

GS8182D36BGD-300I

Memory IC Overview

The GS8182D36BGD-300I is a 18 Mbit Synchronous Burst SRAM manufactured by GSI Technology. It features a memory organization of 512K x 36 bits and supports a maximum clock frequency of 300 MHz. The device operates within a supply voltage range of 1.7 V to 1.9 V, with a maximum power consumption of 605 mA. It utilizes a parallel interface and is housed in a BGA-165 package suitable for surface mount technology. The component is rated for an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed synchronous burst data transfer at frequencies up to 300 MHz
  • Configurable pipeline or flow-through read architecture for system optimization
  • Dual Cycle Deselect (DCD) operation enables efficient low-power standby modes
  • Integrated internal self-timed write cycles simplify controller logic requirements

Memory IC Applications

  • High-performance networking equipment requiring fast packet buffering
  • Telecommunications infrastructure systems utilizing synchronous data processing
  • Industrial control systems demanding wide data bus interfaces
  • Test and measurement instruments needing rapid data acquisition storage

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C) against the manufacturer's official datasheet. Confirm that the BGA-165 package dimensions match the target PCB footprint. Ensure the 1.8V core voltage requirement aligns with the system power design. Check for moisture sensitivity levels and reflow soldering profile constraints during assembly.

Memory IC Selection Notes

Select this component when a 36-bit data width is required alongside high throughput speeds. Compare against the GS8182S36BGD-300I variant if different organizational structures are needed. Consider the GS8182Q series if quad-data-rate signaling is preferred over standard synchronous bursts. Evaluate power consumption limits against the 605 mA maximum specification.

Memory IC Part Context

This part belongs to the SigmaQuad-II SRAM family, designed for separate I/O applications. It complements other members like the GS8182D18BGD-300I which offers an 18-bit width. The series provides scalable memory solutions for bandwidth-intensive applications. It represents a generation of synchronous SRAMs optimized for low latency and high density in compact packages.

Memory IC Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.

GS8182D36BGD-300IGS8182D36BGD-300I
$21.34
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