Memory IC GS8182Q18BGD-300I product image

GS8182Q18BGD-300I

$21.34
  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:0f77602315fb Category: Brand:

  
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GS8182Q18BGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 18MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8182Q18BGD-300I

  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:18Mbit
  • Memory Organization:1M x 18
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8182Q18BGD-300I

GS8182Q18BGD-300I

Memory IC Overview

The GS8182Q18BGD-300I is a 18 Mbit synchronous static random access memory (SRAM) organized as 1M x 18 bits. It operates with a maximum clock frequency of 300 MHz and features a parallel interface. The device supports dual double data rate (DDR) operation within a voltage range of 1.7 V to 1.9 V, with a maximum power supply current of 810 mA. It is housed in a 165-bump BGA package measuring 13 mm by 15 mm with a 1 mm pitch. The component functions reliably across an operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports simultaneous read and write operations via the SigmaQuad-II interface
  • Features fully coherent read and write pipelines for efficient data handling
  • Includes echo clock outputs that track data output drivers

Memory IC Applications

  • High-speed digital signal processing systems
  • Network infrastructure equipment requiring low-latency buffering
  • Test and measurement instruments needing fast data acquisition

Memory IC Procurement Notes

Verify the specific suffix 'IT' against official documentation if industrial temperature rating is required, as standard listings may imply commercial grade. Confirm RoHS compliance status directly with the manufacturer or authorized distributor before procurement. Ensure ESD protection protocols are followed during handling due to moisture sensitivity classification. Validate pinout compatibility with existing PCB layouts referencing the JEDEC MO-216CAB-1 standard.

Memory IC Selection Notes

Select this component when a 18 Mbit capacity with 18-bit word width is necessary for high-throughput applications. The 300 MHz speed class suits designs demanding rapid data throughput without external cache latency. Consider the 165-pin BGA footprint for space-constrained board designs. Verify that the system power supply can maintain stability within the 1.7 V to 1.9 V window to ensure correct DDR timing and signal integrity.

Memory IC Part Context

This part belongs to the GS8182Q series, which utilizes the SigmaQuad-II architecture. These devices are designed for high-performance embedded memory applications. The series offers pin compatibility with other densities in the family, facilitating design scalability. The Q variant specifically denotes the 18-bit data width configuration within the broader SRAM portfolio.

Memory IC Replacement Considerations

Check for GS8182Q18GD-225IT for slower speed variants. Verify cross-compatibility with GS8182R18BGD-300IT if different packaging or suffix conventions apply.

GS8182Q18BGD-300IGS8182Q18BGD-300I
$21.34
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