Memory IC GS8182Q18BGD-333I product image

GS8182Q18BGD-333I

$25.05
  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:139078c43518 Category: Brand:

  
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GS8182Q18BGD-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 18MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8182Q18BGD-333I

  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR II
  • Memory Size:18Mbit
  • Memory Organization:1M x 18
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8182Q18BGD-333I

GS8182Q18BGD-333I

Memory IC Overview

The GS8182Q18BGD-333I is a 18 Mbit Double Data Rate Static Random Access Memory (SRAM) manufactured by GSI Technology. It features a memory organization of 512K words by 36 bits, providing high-density data storage within a compact footprint. The device supports a maximum clock frequency of 333 MHz and operates with a core voltage range of 1.7 V to 1.9 V. It utilizes a parallel interface and is housed in a 165-bump Ball Grid Array (BGA) package measuring 13 mm by 15 mm with a 1 mm bump pitch. The component is designed for industrial temperature applications, functioning reliably between -40°C and +85°C.

Memory IC Feature Summary

  • Supports simultaneous read and write operations via the SigmaQuad-II interface architecture
  • Features fully coherent read and write pipelines for efficient data throughput
  • Includes ZQ mode pin functionality for programmable output drive strength calibration
  • Complies with IEEE 1149.1 JTAG standards for boundary scan testing capabilities

Memory IC Applications

  • High-speed networking equipment requiring low-latency packet buffering
  • Telecommunications infrastructure systems utilizing synchronous burst transfers
  • Industrial control systems operating within extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms industrial temperature rating compliance (-40°C to +85°C). Confirm the 165-bump BGA package dimensions match the target PCB layout constraints. Ensure power supply designs accommodate the specified 1.7 V to 1.9 V core voltage range and peak current requirements during active operation cycles.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required for parallel processing applications. The 333 MHz speed grade suits high-bandwidth interfaces where pipeline coherence is critical. Consider the 165-bump BGA form factor for space-constrained designs needing robust surface-mount assembly. Verify compatibility with existing JEDEC-standard pinout implementations in the system architecture.

Memory IC Part Context

This part belongs to the GS8182 series of SigmaQuad-II SRAMs, which are designed for high-performance synchronous memory applications. The series offers various density and width configurations sharing common package footprints to facilitate design scalability across different product lines within the same family.

Memory IC Replacement Considerations

Direct substitutes include other GS8182 variants with compatible pinouts such as GS8182D18GD-333I or GS8182R08GBD-333, provided the memory organization and interface requirements align with the specific application needs.

GS8182Q18BGD-333IGS8182Q18BGD-333I
$25.05
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