Memory IC GS8182Q36BGD-300I product image

GS8182Q36BGD-300I

$21.34
  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:1f7fff111ad6 Category: Brand:

  
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GS8182Q36BGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 18MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8182Q36BGD-300I

  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8182Q36BGD-300I

GS8182Q36BGD-300I

Memory IC Overview

The GS8182Q36BGD-300I is a 18 Mbit synchronous static random access memory (SRAM) manufactured by GSI Technology. It features a storage organization of 512K x 36 bits and supports a maximum clock frequency of 300 MHz. The device operates within a voltage range of 1.7 V to 1.9 V, with a maximum power supply current of 605 mA. It utilizes a parallel interface and is housed in a BGA-165 package suitable for surface mount technology. The component is rated for an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports SigmaSIO DDR-II interface protocol for separate input/output data transfers
  • Employs pipelined architecture to achieve high-speed synchronous operation
  • Designed for low-voltage applications with dual 1.8V or 1.5V I/O compatibility

Memory IC Applications

  • High-performance networking equipment requiring fast packet buffering
  • Telecommunications systems utilizing synchronous data processing
  • Industrial control systems operating within specified temperature ranges

Memory IC Procurement Notes

Verify the exact part number suffix against official GSI Technology documentation to confirm speed grade and temperature rating. Confirm RoHS compliance status through the manufacturer's declaration. Check for moisture sensitivity level requirements during handling and storage. Ensure the BGA-165 footprint matches the target PCB design specifications before procurement.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required at speeds up to 300 MHz. The SigmaSIO DDR-II interface is suitable for applications needing separate read and write data paths. Consider the 1.8V/1.5V operating voltage for compatibility with modern low-power logic families. The industrial temperature range makes it appropriate for demanding environmental conditions.

Memory IC Part Context

This device belongs to the GS8182 series of synchronous SRAMs from GSI Technology. The series includes various configurations such as the GS8182S36BGD and GS8182Q08BGD. These parts share common packaging and interface standards but differ in organization and specific interface protocols like SigmaQuad-II. The GS8182Q36BGD-300I specifically implements the SigmaSIO DDR-II standard.

Memory IC Replacement Considerations

Consult official GSI Technology substitution guides for verified alternatives. Cross-reference pinouts and electrical characteristics carefully. Generic SRAM replacements may not support the specific SigmaSIO DDR-II protocol.

GS8182Q36BGD-300IGS8182Q36BGD-300I
$21.34
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