Memory IC GS8182Q36BGD-333I product image

GS8182Q36BGD-333I

$25.05
  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:a91e57ebf30e Category: Brand:

  
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GS8182Q36BGD-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 18MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8182Q36BGD-333I

  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR II
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8182Q36BGD-333I

GS8182Q36BGD-333I

Memory IC Overview

The GS8182Q36BGD-333I is a 18 Mbit Double Data Rate Static Random Access Memory (DDR SRAM) manufactured by GSI Technology. It features a memory organization of 512K x 36 bits and supports a maximum clock frequency of 333 MHz. The device operates within a core voltage range of 1.7 V to 1.9 V and an I/O voltage range of 1.5 V or 1.8 V. It utilizes a parallel interface and is housed in a 165-bump Ball Grid Array (BGA) package with dimensions of 13 mm x 15 mm and a 1 mm bump pitch. The component is rated for industrial operating temperatures from -40°C to +85°C.

Memory IC Feature Summary

  • Supports simultaneous read and write operations through the SigmaQuad-II interface architecture
  • Features fully coherent read and write pipelines for efficient data handling
  • Includes echo clock outputs that track data output drivers for precise timing
  • Complies with JEDEC-standard pinout and package specifications

Memory IC Applications

  • High-speed networking equipment requiring low-latency buffering
  • Telecommunications systems utilizing synchronous data processing
  • Industrial control systems demanding reliable memory storage in harsh environments

Memory IC Procurement Notes

Verify current availability status as supply may be restricted. Confirm RoHS compliance details and moisture sensitivity level prior to assembly. Ensure proper ESD handling procedures are followed during installation. Check for end-of-life notifications or discontinuance alerts from the manufacturer. Validate that the BGA-165 footprint matches the target PCB design constraints.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required at high synchronization speeds. The 18 Mbit capacity suits applications needing moderate density with fast access times. Consider the 165-bump BGA package for surface-mount integration. Verify power supply requirements align with the specified 1.5 V or 1.8 V I/O levels and 1.8 V core voltage.

Memory IC Part Context

This part belongs to the GS8182 series of DDR SRAMs, which are designed for high-performance embedded memory applications. The series includes various configurations such as 18-bit and 36-bit widths with different speed grades. These devices are characterized by their pipelined architecture and compatibility with standard interfaces, making them suitable for complex digital signal processing tasks.

Memory IC Replacement Considerations

Check for pin-compatible alternatives within the GS8182 family, such as the GS8182T37BGD-333I, if a different organization is acceptable. Verify electrical parameters and package dimensions before substitution.

GS8182Q36BGD-333IGS8182Q36BGD-333I
$25.05
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