Memory IC GS8182R36BGD-300I product image

GS8182R36BGD-300I

$21.34
  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:e0f48c7763c5 Category: Brand:

  
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GS8182R36BGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 18MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8182R36BGD-300I

  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, DDR II
  • Memory Size:18Mbit
  • Memory Organization:512K x 36
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8182R36BGD-300I

GS8182R36BGD-300I

Memory IC Overview

The GS8182R36BGD-300I is a 18 Mbit synchronous burst static random access memory (SRAM) manufactured by GSI Technology. It features a data organization of 512K words by 36 bits and operates with a maximum clock frequency of 300 MHz. The device supports dual voltage operation, utilizing a 1.8 V core supply and compatible 1.8 V or 1.5 V I/O levels. It is housed in a 165-bump ball grid array (BGA) package measuring 13 mm by 15 mm with a 1 mm bump pitch. The component is designed for commercial temperature ranges, functioning reliably between -40°C and +85°C.

Memory IC Feature Summary

  • Supports high-speed synchronous parallel interface with up to 300 MHz clock frequency
  • Features SigmaQuad-II architecture allowing flexible x36, x18, or x9 configurations
  • Includes ZQ pin for programmable output drive strength calibration
  • Complies with IEEE 1149.1 JTAG standard for boundary scan testing

Memory IC Applications

  • High-performance networking equipment requiring low latency buffering
  • Telecommunications infrastructure systems
  • Industrial control systems demanding reliable data storage
  • Test and measurement instrumentation

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature range (-40°C to +85°C) as distinct from commercial variants. Confirm RoHS compliance status through official manufacturer documentation prior to integration. Ensure PCB layout accommodates the 165-bump BGA footprint dimensions of 13 mm x 15 mm. Validate power supply sequencing for the 1.8V core and 1.5V/1.8V I/O rails against the datasheet specifications.

Memory IC Selection Notes

Select this component when a wide data bus width of 36 bits is required at high speeds. It serves as an alternative to narrower bus SRAMs by reducing pin count for equivalent capacity. Consider the 165-bump BGA package constraints for board space. Verify that the system design supports the necessary voltage levels for both core and I/O operations.

Memory IC Part Context

This part belongs to the GS8182 family of 18Mb DDR SRAMs. It shares architectural similarities with models like GS8182S36BGD-300I but differs in interface type and speed grade. The family utilizes GSI's SigmaQuad-II technology to optimize performance and power consumption for embedded memory applications.

Memory IC Replacement Considerations

Direct substitutes include other GS8182 series parts with matching 36-bit width and 300 MHz speed, such as GS8182S36BGD-300I, provided interface compatibility is confirmed.

GS8182R36BGD-300IGS8182R36BGD-300I
$21.34
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