Memory IC GS8182T19BGD-400I product image

GS8182T19BGD-400I

$29.69
  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:4265421cd6f3 Category: Brand:

  
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GS8182T19BGD-400I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 18MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8182T19BGD-400I

  • Description:IC SRAM 18MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous
  • Memory Size:18Mbit
  • Memory Organization:1M x 18
  • Memory Interface:Parallel
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8182T19BGD-400I

GS8182T19BGD-400I

Memory IC Overview

The GS8182T19BGD-400I is a 72 Mbit Double Data Rate Static Random Access Memory (DDR SRAM) manufactured by GSI Technology. It features a memory organization of 4 Megawords by 18 bits and supports a maximum clock frequency of 400 MHz. The device operates within a voltage range of 1.7 V to 1.9 V, with a maximum power supply current of 635 mA. It utilizes a parallel interface and is housed in a 165-ball Ball Grid Array (BGA) package suitable for surface mount technology. The component is rated for an industrial operating temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports simultaneous read and write operations via the SigmaCIO interface architecture
  • Features a pipelined architecture designed for high-speed data transfer
  • Includes a ZQ pin for programmable output drive strength calibration

Memory IC Applications

  • High-performance networking equipment requiring low latency memory
  • Telecommunications infrastructure systems
  • Industrial control applications demanding wide temperature stability

Memory IC Procurement Notes

Verify the specific suffix codes against official manufacturer documentation to confirm exact speed grades and temperature ranges. Confirm RoHS compliance status and moisture sensitivity levels prior to assembly. Ensure that the BGA-165 footprint matches the target PCB design specifications exactly.

Memory IC Selection Notes

Select this component when a 72 Mbit capacity with 400 MHz synchronous performance is required. The 18-bit data width suits applications needing precise data alignment without additional masking logic. Verify that the 1.8V or 1.5V I/O voltage compatibility aligns with the system's core voltage requirements.

Memory IC Part Context

This part belongs to the SigmaDDR-II+ family of SRAMs, which are designed to implement economical high-performance networking solutions. The series provides quad SRAM capacity with the ability to transfer multiple data beats per clock cycle, optimizing bus bandwidth utilization for complex digital signal processing tasks.

Memory IC Replacement Considerations

Cross-reference with other GS8662 variants for different speed grades or temperature ratings. Verify pinout compatibility before substituting with similar 72 Mbit DDR SRAM devices from alternative manufacturers.

GS8182T19BGD-400IGS8182T19BGD-400I
$29.69
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