GS8182T36BGD-300I

Memory IC Overview

The GS8182T36BGD-300I is a synchronous static random access memory (SRAM) device manufactured by GSI Technology. It features an 18 Mbit storage capacity organized as 512K x 36 bits. The component supports a maximum clock frequency of 300 MHz and utilizes a parallel interface. It operates within a voltage range of 1.7 V to 1.9 V, with a maximum power consumption of 605 mA. The device is housed in a 165-pin BGA package suitable for surface mount technology and functions within a temperature range of -40°C to +85°C.

Memory IC Feature Summary

• Supports high-speed data transfer via a 300 MHz synchronous parallel interface
• Provides wide data bus width through a 36-bit organization structure
• Operates on low-voltage power supplies ranging from 1.5V to 1.8V

Memory IC Applications

• High-performance embedded communication systems
• Network infrastructure equipment requiring large buffer memory
• Industrial control systems operating in extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix 'GD' and '-300I' against official datasheets to confirm pinout compatibility and speed grade. Ensure that the 165-pin BGA footprint matches the target PCB design. Confirm RoHS compliance status and moisture sensitivity levels before assembly to prevent damage during soldering processes.

Memory IC Selection Notes

Select this component when a wide 36-bit data path is required alongside high-frequency operation up to 300 MHz. Consider the industrial temperature range if the application environment exceeds standard commercial limits. Evaluate the power consumption specifications against available thermal management capabilities in the final enclosure design.

Memory IC Part Context

This part belongs to the SigmaSIO DDR-II series of SRAMs from GSI Technology. It shares the same physical package and basic electrical characteristics with other variants in the family, differing primarily in density and speed grades. The series is designed for applications demanding high bandwidth and low latency memory solutions.

Memory IC Replacement Considerations

Check for direct substitutes such as the GS8182S36BGD-300I or GS8182D37BD-300I, which share similar organizational structures and package types. Verify functional equivalence regarding voltage levels and timing parameters before substitution.