Memory IC GS8256418GD-250I product image

GS8256418GD-250I

$379.29
  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:aaa0bd865362 Category: Brand:

  
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GS8256418GD-250I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8256418GD-250I

  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, Standard
  • Memory Size:288Mbit
  • Memory Organization:16M x 18
  • Memory Interface:Parallel
  • Clock Frequency:250 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8256418GD-250I

GS8256418GD-250I

Memory IC Overview

The GS8256418GD-250I is a 288 Mbit Static Random Access Memory (SRAM) manufactured by GSI Technology. It features a memory organization of 16 M x 18 bits and supports dual voltage operation at 2.5V or 3.3V, with supply voltage ranges from 2.3 V to 3.6 V. The component operates with a maximum clock frequency of 250 MHz and an access time of 5.5 ns. It utilizes a parallel interface and is housed in a BGA-165 package for surface mount installation. The device functions within an industrial temperature range of -40°C to +100°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via a 250 MHz synchronous burst architecture.
  • Enables flexible power integration through dual 2.5V/3.3V voltage compatibility.
  • Provides robust environmental stability for industrial applications across extended temperature ranges.

Memory IC Applications

  • High-performance networking equipment requiring fast packet buffering
  • Industrial control systems demanding reliable data storage under extreme temperatures
  • Telecommunications infrastructure utilizing synchronous burst memory interfaces

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +100°C) against official datasheets. Confirm the BGA-165 package dimensions and pinout match the design requirements. Ensure the 2.5V/3.3V dual-voltage capability aligns with the target system power rails. Check for moisture sensitivity levels and reflow soldering profiles suitable for the SMD/SMT mounting style.

Memory IC Selection Notes

Select this component when a 288 Mbit capacity with 18-bit word width is required for synchronous burst operations. It is suitable for designs needing 250 MHz performance with low latency. Consider the BGA-165 footprint for space-constrained PCB layouts. Verify that the operating voltage range fits the available power supplies in the application environment.

Memory IC Part Context

This part belongs to the GS8256418GD series of SyncBurst SRAMs. It shares architectural similarities with other members like the GS8256418GD-200I but offers higher speed capabilities. The series is designed for applications requiring large block memory with fast access times in industrial and commercial environments.

Memory IC Replacement Considerations

The GS8256418GD-200I is a slower variant within the same family. Cross-referencing with other GSI Technology SRAMs requires verifying pin compatibility and voltage specifications.

GS8256418GD-250IGS8256418GD-250I
$379.29
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