Memory IC GS8256418GD-400I product image

GS8256418GD-400I

$451.89
  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:6ebe523a7cf8 Category: Brand:

  
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GS8256418GD-400I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8256418GD-400I

  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, Standard
  • Memory Size:288Mbit
  • Memory Organization:16M x 18
  • Memory Interface:Parallel
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8256418GD-400I

GS8256418GD-400I

Memory IC Overview

The GS8256418GD-400I is a 288 Mbit synchronous static random-access memory (SRAM) manufactured by GSI Technology Inc. It features a memory organization of 16M x 18 bits and operates with a maximum clock frequency of 400 MHz. The device supports dual-voltage operation at 2.5V or 3.3V, with a supply voltage range from 2.3V to 3.6V. Access time is specified at 4 ns. It utilizes a parallel interface and is housed in a BGA-165 package. The component is rated for an operating temperature range of -40°C to +100°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via a 400 MHz synchronous parallel interface
  • Enables flexible power integration through dual 2.5V/3.3V voltage compatibility
  • Provides extended thermal stability suitable for demanding industrial environments

Memory IC Applications

  • High-performance networking equipment requiring low-latency buffering
  • Industrial control systems operating under wide temperature conditions
  • Telecommunications infrastructure utilizing synchronous burst memory architectures

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +100°C) against the official datasheet. Confirm the BGA-165 package dimensions and pinout match the target PCB footprint. Ensure the 2.5V/3.3V dual-voltage capability aligns with the system power rails. Check for moisture sensitivity level requirements during storage and handling.

Memory IC Selection Notes

Select this component when a 288 Mbit capacity with 18-bit word width is required. The 400 MHz speed class suits applications needing rapid data throughput. Consider the BGA-165 form factor for space-constrained designs. Verify that the system can support the specified current consumption levels at the chosen operating voltage.

Memory IC Part Context

This part belongs to the GS8256418GD series of SyncBurst SRAMs. It shares the 16M x 18 organization with other variants like the GS8256418GD-200I but offers higher performance. The series is designed for pipeline/flow-through operations, distinguishing it from lower-speed asynchronous alternatives within the broader memory portfolio.

Memory IC Replacement Considerations

The GS8256418GD-200I is a confirmed slower variant within the same series. Cross-referencing with other manufacturers requires verifying pin compatibility and electrical specifications.

GS8256418GD-400IGS8256418GD-400I
$451.89
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