GS82564Z36GB-200IV

Memory IC Overview

The GS82564Z36GB-200IV is a 288 Mbit synchronous NBT SRAM manufactured by GSI Technology. It features an 8M x 36 organization and supports both pipelined and flow-through architectures. The device operates with a maximum clock frequency of 200 MHz and has a minimum access time of 6.5 ns. It utilizes parallel interface technology and accepts power supply voltages ranging from 2.3 V to 3.6 V. Maximum power consumption reaches 460 mA or 510 mA depending on the mode. The component is housed in a BGA-119 package suitable for surface mount applications and functions within a temperature range of -40°C to +100°C.

Memory IC Feature Summary

• Supports both pipelined and flow-through operational modes for flexible system integration
• Features internal self-timed write cycles and automatic power-down capabilities
• Includes IEEE 1149.1 JTAG-compatible boundary scan for testing and verification

Memory IC Applications

• High-speed data buffering in telecommunications equipment
• Cache memory implementation in network processing systems
• Frame buffer storage in video processing hardware

Memory IC Procurement Notes

Verify the specific suffix IV indicates industrial temperature range compliance (-40°C to +100°C) against your design requirements. Confirm that the BGA-119 footprint matches your PCB layout constraints. Ensure voltage levels align with the specified 2.3 V to 3.6 V operating window. Check for RoHS compliance status if required by your manufacturing standards. Validate pinout compatibility with existing system designs before procurement.

Memory IC Selection Notes

Select this component when high-density 36-bit wide memory is required at 200 MHz speeds. Consider the dual architecture support if system latency varies between burst and continuous operations. Evaluate the thermal performance within the industrial temperature range for harsh environments. Compare power consumption metrics against lower-speed alternatives if energy efficiency is critical. Ensure the BGA-119 package fits within the available board space constraints.

Memory IC Part Context

This part belongs to the GSI Technology synchronous SRAM family, designed for high-performance embedded applications. It shares architectural similarities with other ZBT SRAMs but offers specific density and speed combinations. The device integrates advanced features like byte write and global write operations. It is positioned as a solution for systems requiring fast random access and large data buffers.

Memory IC Replacement Considerations

Direct substitutes include the GS82564Z36GD-333V for higher speed requirements, though it uses a different BGA-165 package. Lower speed variants within the same series may offer cost savings but will not meet the 200 MHz requirement. Verify pin-to-pin compatibility when considering alternative packages or densities.