Memory IC GS82564Z36GD-250I product image

GS82564Z36GD-250I

$379.29
  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:a85d9c5007ad Category: Brand:

  
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GS82564Z36GD-250I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS82564Z36GD-250I

  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:288Mbit
  • Memory Organization:8M x 36
  • Memory Interface:Parallel
  • Clock Frequency:250 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS82564Z36GD-250I

GS82564Z36GD-250I

Memory IC Overview

The GS82564Z36GD-250I is a 288 Mbit synchronous static random access memory (SRAM) manufactured by GSI Technology. It features an organization of 8 Megawords by 36 bits and supports maximum clock frequencies up to 250 MHz with a typical access time of 5 nanoseconds. The device operates within a voltage range of 1.8V to 2.5V, utilizing dual power supply rails for core and I/O interfaces. It is housed in a BGA-165 surface-mount package and is rated for industrial operating temperatures ranging from -40°C to +85°C.

Memory IC Feature Summary

  • Supports both pipelined and flow-through synchronous operation modes for flexible data throughput requirements.
  • Features independent VCC and VCCQ power supplies to accommodate mixed-voltage system environments.
  • Includes on-chip PLL circuitry to ensure stable clocking performance at high frequencies.

Memory IC Applications

  • High-speed networking equipment requiring low-latency packet buffering
  • Telecommunications infrastructure systems
  • Industrial automation control units

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the 'GD' designation aligns with the required BGA-165 package type. Ensure the 250MHz speed bin matches the target system timing constraints before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 288 Mbit capacity with a 36-bit wide interface is required. The 250 MHz speed grade offers higher bandwidth than the 200 MHz variant while maintaining compatibility with standard 1.8V/2.5V logic levels. Consider the BGA-165 footprint for PCB layout planning.

Memory IC Part Context

This part belongs to the NBT SRAM family, designed for high-performance embedded applications. It shares architectural similarities with other models in the GS82564 series but differs in speed grade and package configuration. The device represents a solution for dense, fast memory storage in compact form factors.

Memory IC Replacement Considerations

Direct replacements include the GS82564Z36GB-250I or GS82564Z36GD-333V if higher speeds are acceptable. Verify pinout compatibility and thermal characteristics when substituting with other 288 Mbit SRAM devices from different manufacturers.

GS82564Z36GD-250IGS82564Z36GD-250I
$379.29
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