GS82564Z36GD-400I

$451.89

Description：IC SRAM 288MBIT PAR 165FPBGA
Series：-
Mfr：GSI Technology Inc.
Package：Tray

SKU:b156bc36c461 Category: Memory IC Brand: GSI Technology Inc.

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Product introduction

GS82564Z36GD-400I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS82564Z36GD-400I

Description：IC SRAM 288MBIT PAR 165FPBGA
Series：-
Mfr：GSI Technology Inc.
Package：Tray
Memory Type：Volatile
Memory Format：SRAM
Technology：SRAM - Synchronous, ZBT
Memory Size：288Mbit
Memory Organization：8M x 36
Memory Interface：Parallel
Clock Frequency：400 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：2.3V ~ 2.7V, 3V ~ 3.6V
Operating Temperature：-40°C ~ 100°C (TJ)
Mounting Type：Surface Mount
Package / Case：165-LBGA
Supplier Device Package：165-FPBGA (13x15)
Access Time：-

Memory IC datasheet and documents for GS82564Z36GD-400I

GS82564Z36GD-400I

Memory IC Overview

The GS82564Z36GD-400I is a 288 Mbit Static Random Access Memory (SRAM) organized as 8 Megawords by 36 bits. It operates with a maximum clock frequency of 400 MHz and features a parallel interface. The device supports dual voltage supplies, accepting 2.5V or 3.3V logic levels, with an operating range from 2.3V to 3.6V. It utilizes a BGA-165 package for surface mount installation. The component is rated for industrial temperatures between -40°C and +100°C and includes boundary scan capabilities.

Memory IC Feature Summary

Supports high-speed data transfer at up to 400 MHz via a parallel interface
Enables flexible system integration through selectable 2.5V or 3.3V supply voltages
Provides comprehensive diagnostic coverage using integrated boundary scan (JTAG) functionality

Memory IC Applications

High-performance networking equipment requiring low-latency buffering
Telecommunications infrastructure utilizing wide data buses
Industrial control systems operating in extended temperature environments

Memory IC Procurement Notes

Verify the specific suffix GD against official GSI Technology documentation to confirm the BGA-165 package configuration. Ensure that the selected voltage supply aligns with the 2.5V or 3.3V operational requirements specified in the datasheet. Confirm humidity sensitivity handling procedures are followed during assembly to prevent damage to the moisture-sensitive device.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required alongside high throughput speeds. The dual-voltage capability allows compatibility with mixed-signal systems. Verify that the PCB layout accommodates the BGA-165 footprint and that thermal management strategies support the specified industrial temperature range without exceeding power dissipation limits.

Memory IC Part Context

This part belongs to the GS82564 series of SyncBurst SRAMs manufactured by GSI Technology. These devices are designed for applications demanding fast access times and large memory depths. The series typically offers pipeline flow-through architecture to maximize bandwidth efficiency in complex digital signal processing tasks.