GS82582D20GE-550I

Memory IC Overview

The GS82582D20GE-550I is a synchronous static random-access memory component manufactured by GSI Technology. It features a storage capacity of 288 Mbit organized as 16M x 18 bits. The device supports a maximum clock frequency of 550 MHz and operates within a supply voltage range of 1.7 V to 1.9 V. Maximum power consumption is specified at 1.15 A. It utilizes a parallel interface and is housed in a BGA-165 package suitable for surface mount technology. The operational temperature range extends from -40°C to +100°C.

Memory IC Feature Summary

• Supports high-speed synchronous data transfer with a maximum clock frequency of 550 MHz
• Operates on dual voltage supplies of 1.5V or 1.8V for flexible system integration
• Provides wide data bus width of 18 bits per access cycle

Memory IC Applications

• High-performance networking equipment requiring low-latency buffering
• Telecommunications infrastructure systems
• Industrial automation control units

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature rating of -40°C to +100°C, distinct from commercial variants. Confirm the BGA-165 package dimensions match your PCB footprint requirements. Ensure your design accounts for the 1.15 A maximum current draw during peak operation. Check moisture sensitivity levels for proper reflow soldering profiles. Validate that the 1.7V to 1.9V supply rails are stable under all load conditions.

Memory IC Selection Notes

Select this part when a 288 Mbit density with an 18-bit word width is required. The 550 MHz speed class suits applications needing rapid data throughput. The wide operating temperature range makes it suitable for harsh environments. Compare against other SigmaQuad-II+ series members if different densities or widths are needed. Ensure the BGA-165 form factor fits the available board space constraints.

Memory IC Part Context

This component belongs to the GS82582D20GE series, which represents GSI Technology's SigmaQuad-II+ family of synchronous SRAMs. These devices are designed for high-speed data processing tasks where latency is critical. The series offers various configurations balancing speed, density, and power consumption for diverse embedded memory needs.

Memory IC Replacement Considerations

Consult official cross-reference lists for direct pin-compatible substitutes within the same manufacturer portfolio. Verify electrical compatibility before substituting with similar parts from other vendors.