GS82582DT20GE-500I

Memory IC Overview

The GS82582DT20GE-500I is a 288 Mbit Standard SRAM organized as 16M x 18. It operates with a maximum clock frequency of 500 MHz and features a parallel interface. The device supports supply voltages between 1.7 V and 1.9 V, with a maximum supply current of 920 mA. It functions within an operating temperature range of -40°C to +100°C and is housed in a BGA-165 package.

Memory IC Feature Summary

• Supports high-speed synchronous data transfer via a parallel interface architecture.
• Operates on dual voltage supplies of 1.5V or 1.8V for flexible power integration.
• Designed for extended industrial temperature ranges up to +100°C.

Memory IC Applications

• High-performance networking equipment requiring low-latency buffering
• Telecommunications infrastructure systems
• Industrial control applications demanding wide temperature stability

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +100°C) against the manufacturer's datasheet. Confirm the BGA-165 pinout matches the target PCB footprint. Ensure the 1.5V/1.8V dual-voltage requirement aligns with the system power design. Check for RoHS compliance status if required by local regulations.

Memory IC Selection Notes

Select this component when a 16M x 18 organization is required at 500 MHz speeds. It is suitable for designs needing operation up to +100°C, distinguishing it from commercial grade variants limited to +85°C. Consider the 920 mA maximum current draw for adequate power plane capacity and thermal management planning.

Memory IC Part Context

This part belongs to the SigmaQuad-II+ family of static random-access memories. These devices are engineered for high-throughput applications where deterministic latency and high bandwidth are critical. The series offers various density and speed options within a standardized BGA-165 form factor.

Memory IC Replacement Considerations

Compatible substitutes include other GS82582DT20GE variants with different speed grades (e.g., -400I) or temperature ratings (e.g., -T). Verify that any replacement maintains the 16M x 18 organization and BGA-165 package to ensure mechanical and logical compatibility.