GS82582DT38GE-500I

Memory IC Overview

The GS82582DT38GE-500I is a synchronous static random access memory device manufactured by GSI Technology. It features a storage capacity of 288 Mbit organized as 8 M x 36 bits. The component supports a maximum clock frequency of 500 MHz and utilizes a parallel interface. It operates within a voltage range of 1.7 V to 1.9 V, with a maximum power consumption of 980 mA. The device is housed in a BGA-165 package suitable for surface mount technology and functions reliably across an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

• Supports high-speed synchronous data transfer at frequencies up to 500 MHz
• Provides wide 36-bit data bus width for efficient parallel processing
• Operates on dual voltage supplies of 1.5V or 1.8V for flexible system integration

Memory IC Applications

• High-performance networking equipment requiring low-latency buffering
• Telecommunications infrastructure systems
• Industrial automation control units

Memory IC Procurement Notes

Verify the specific suffix codes against official manufacturer documentation to ensure correct speed grade and temperature rating compatibility. Confirm that the BGA-165 footprint matches your PCB design constraints. Check for moisture sensitivity levels and reflow soldering profile requirements prior to assembly. Ensure supply chain sources provide genuine components with traceable origin records.

Memory IC Selection Notes

Select this component when a wide 36-bit data path is required alongside high-frequency operation. Compare power consumption metrics against alternative SRAM families for thermal management planning. Evaluate the BGA-165 package density relative to available board space. Consider the operating temperature range suitability for your specific environmental conditions.

Memory IC Part Context

This part belongs to the SigmaQuad-II+ family of synchronous SRAMs from GSI Technology. These devices are engineered for applications demanding high bandwidth and deterministic latency. The series offers various organization options and speed grades to accommodate different system architectures while maintaining pin-to-pin compatibility within specific subsets.

Memory IC Replacement Considerations

Consult official substitution guides for compatible parts within the same family. Verify electrical parameters and pin configurations before replacing existing inventory.