Memory IC GS82582Q20GE-500I product image

GS82582Q20GE-500I

$392.64
  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:0d25b14007de Category: Brand:

  
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GS82582Q20GE-500I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS82582Q20GE-500I

  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, QDR II+
  • Memory Size:288Mbit
  • Memory Organization:16M x 18
  • Memory Interface:Parallel
  • Clock Frequency:500 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x17)
  • Access Time:-

Memory IC datasheet and documents for GS82582Q20GE-500I

GS82582Q20GE-500I

Memory IC Overview

The GS82582Q20GE-500I is a Quad Port Dynamic Random Access Memory (QDR II+) static random access memory IC manufactured by GSI Technology. It features a total storage capacity of 288 Mbit, organized as four independent ports of 16M x 18 bits each. The device supports a maximum clock frequency of 500 MHz with a parallel interface. It operates within a supply voltage range of 1.7 V to 1.9 V and functions reliably across an industrial temperature range from -40°C to +100°C. The component is housed in a 165-ball Fine-Pitch Ball Grid Array (FPBGA) package measuring 15x17 mm.

Memory IC Feature Summary

  • Quad-port architecture providing four independent data paths for simultaneous read and write operations
  • Built-in delay-locked loop (DLL) for precise timing control and synchronization
  • Boundary scan (JTAG) function integrated for enhanced testability and manufacturing verification

Memory IC Applications

  • High-speed networking equipment requiring low-latency packet buffering
  • Telecommunications infrastructure utilizing synchronous data processing
  • Industrial automation systems demanding reliable multi-port memory access

Memory IC Procurement Notes

Verify the specific suffix codes against official datasheets to confirm voltage levels, temperature ranges, and packaging variants. Ensure compatibility with existing board layouts regarding the 165-ball FPBGA footprint. Confirm that the selected variant meets all required environmental and electrical specifications for the target application environment before finalizing procurement orders.

Memory IC Selection Notes

Select this component when quad-port bandwidth is critical for system throughput. The QDR II+ technology offers deterministic latency compared to traditional SRAMs. Consider the 165-pin BGA package constraints during mechanical design. Evaluate power consumption profiles at 500 MHz operation to ensure adequate thermal management solutions are implemented on the printed circuit board.

Memory IC Part Context

This part belongs to the GS82582 series of QDR II+ memories, designed for high-performance embedded applications. The series utilizes advanced CMOS technology to deliver high density and speed. GSI Technology specializes in custom and standard memory solutions for telecommunications and computing markets. This specific model represents a mature product line with established reliability records in industrial sectors.

Memory IC Replacement Considerations

Direct replacements must match the 288 Mbit capacity, 165-pin BGA package, and 500 MHz clock speed. Verify pin-to-pin compatibility if substituting with other QDR II+ devices. Cross-reference with GS82582Q38E or similar series members only if organization differences are acceptable.

GS82582Q20GE-500IGS82582Q20GE-500I
$392.64
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