Memory IC GS82582Q36GE-333I product image

GS82582Q36GE-333I

$358.62
  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:02159d5a257a Category: Brand:

  
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GS82582Q36GE-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS82582Q36GE-333I

  • Description:IC SRAM 288MBIT PAR 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:288Mbit
  • Memory Organization:8M x 36
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x17)
  • Access Time:-

Memory IC datasheet and documents for GS82582Q36GE-333I

GS82582Q36GE-333I

Memory IC Overview

The GS82582Q36GE-333I is a static random-access memory device manufactured by GSI Technology. It features a storage capacity of 288 Mbit organized as 8 M x 36 bits. The component operates with a maximum clock frequency of 333 MHz and utilizes a parallel interface. Power supply requirements range from a minimum of 1.7 V to a maximum of 1.9 V, with a maximum power current of 1.3 A. The device supports QDR-II storage type within the SigmaQuad-II series. It is housed in a BGA-165 package suitable for SMD/SMT installation and functions within an operating temperature range of -40 C to +85 C.

Memory IC Feature Summary

  • Supports high-speed data transfer via QDR-II technology
  • Provides wide data bus width for efficient system integration
  • Operates within standard industrial temperature ranges

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure systems
  • Industrial automation control units

Memory IC Procurement Notes

Verify the specific revision level and moisture sensitivity classification before procurement. Confirm that the BGA-165 footprint matches the target PCB design constraints. Ensure voltage regulators can maintain the 1.7 V to 1.9 V supply range under peak load conditions. Check for RoHS compliance documentation if required by local regulations. Validate thermal management strategies for operation at the upper temperature limit.

Memory IC Selection Notes

Select this component when a wide data path and synchronous parallel interface are required. Consider the QDR-II architecture for applications needing predictable latency. Evaluate the BGA-165 package density against available board space. Compare power consumption specifications against alternative SRAM families. Ensure the operating temperature range aligns with the environmental conditions of the final assembly.

Memory IC Part Context

This part belongs to the GS82582Q36GE series, which represents GSI Technology's SigmaQuad-II line of quad data rate SRAMs. These devices are designed for high-throughput applications requiring fast access times. The series typically includes variants with different speed grades and organizational structures. The manufacturer focuses on providing reliable memory solutions for demanding digital signal processing tasks.

Memory IC Replacement Considerations

Check for compatible parts within the same SigmaQuad-II family that offer similar pinouts. Verify electrical compatibility with existing system voltage rails. Ensure mechanical dimensions match the current BGA-165 footprint. Review datasheets for any changes in timing parameters or power characteristics.

GS82582Q36GE-333IGS82582Q36GE-333I
$358.62
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