Memory IC GS82583ED18GK-625I product image

GS82583ED18GK-625I

$494.06
  • Description:IC SRAM 288MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:e59b594b2aed Category: Brand:

  
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GS82583ED18GK-625I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 260BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS82583ED18GK-625I

  • Description:IC SRAM 288MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:288Mbit
  • Memory Organization:16M x 18
  • Memory Interface:Parallel
  • Clock Frequency:675 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.25V ~ 1.35V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:260-BGA
  • Supplier Device Package:260-BGA (22x14)
  • Access Time:-

Memory IC datasheet and documents for GS82583ED18GK-625I

GS82583ED18GK-625I

Memory IC Overview

The GS82583ED18GK-625I is a 288Mb synchronous static random access memory (SRAM) from the SigmaQuad-IIIe family. It features an 8M x 36 organization and supports a maximum operating frequency of 625 MHz with a peak transaction rate of 625 MT/s. The device utilizes a 1.3V nominal core voltage (VDD range: 1.25V to 1.35V) and supports HSTL I/O interfaces at 1.2V, 1.3V, or 1.5V (VDDQ). It employs separate input/output DDR data buses, non-multiplexed SDR address buses, and performs burst-of-4 read/write operations with a 3-cycle read latency.

Memory IC Feature Summary

  • Supports burst-of-4 read and write operations for high throughput
  • Features separate I/O DDR data buses and non-multiplexed SDR address bus
  • Includes programmable driver impedance via ZQ pin and configurable on-die termination (ODT)
  • Integrates a DLL for output timing control and source-synchronous operation

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure
  • Data center storage systems

Memory IC Procurement Notes

Verify that the specific speed grade suffix matches the required clock frequency. Confirm the I/O voltage configuration by checking the MVQ pin requirement against the system power supply. Ensure the package type corresponds to the board layout constraints. Validate RoHS compliance status if required by local regulations. Check for moisture sensitivity level requirements during assembly.

Memory IC Selection Notes

Select this component when a 288Mb capacity with an 8M x 36 data width is required. Choose this part over other organizations if the system architecture demands a 36-bit interface width. Consider the 625 MHz speed grade for applications requiring lower latency than the -675 grade but higher performance than slower variants. Ensure the design supports the necessary VDD and VDDQ power sequencing.

Memory IC Part Context

This device belongs to the SigmaQuad-IIIe family, which represents the third generation of GSI's high-performance SRAMs. It shares architectural similarities with the second-generation SigmaQuad-II/SigmaDDR-II family but offers enhanced capabilities for higher frequencies. The family includes both Separate I/O (SigmaQuad-IIIe) and multiplexed I/O (SigmaDDR-IIIe) variants.

Memory IC Replacement Considerations

Other speed grades within the same package, such as GS82583ED18GK-675I, may be compatible if the system clock can be adjusted. Devices with different organizations, like the 16M x 18 variant, are not direct pin-compatible replacements due to address pin differences.

GS82583ED18GK-625IGS82583ED18GK-625I
$494.06
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