Memory IC GS82583ED36GK-675I product image

GS82583ED36GK-675I

$622.94
  • Description:IC SRAM 288MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:c334ec81f4c9 Category: Brand:

  
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GS82583ED36GK-675I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 260BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS82583ED36GK-675I

  • Description:IC SRAM 288MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:288Mbit
  • Memory Organization:8M x 36
  • Memory Interface:Parallel
  • Clock Frequency:675 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.25V ~ 1.35V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:260-BGA
  • Supplier Device Package:260-BGA (22x14)
  • Access Time:-

Memory IC datasheet and documents for GS82583ED36GK-675I

GS82583ED36GK-675I

Memory IC Overview

The GS82583ED36GK-675I is a QDR-III SRAM with 288 Mbit capacity, organized as 8M x 36. It operates at a maximum clock frequency of 675 MHz with a 400 ps access time. The device uses a parallel interface and supports 1.2V/1.5V power supplies (1.25V to 1.35V). It features a BGA-260 package, SMD/SMT mounting, and operates between -40°C and +100°C.

Memory IC Feature Summary

  • Supports high-speed synchronous data transfer via Quad Data Rate III architecture
  • Provides wide 36-bit data path for high-bandwidth applications
  • Operates within extended industrial temperature range

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure
  • Data center storage systems

Memory IC Procurement Notes

Verify the specific speed grade suffix matches system timing requirements. Confirm voltage compatibility with target board design. Check moisture sensitivity level handling procedures before assembly. Ensure BGA-260 footprint alignment with PCB layout specifications.

Memory IC Selection Notes

Select this model for designs requiring 675 MHz throughput. Compare against lower speed variants if power consumption is critical. Verify that the 36-bit width fits the controller interface. Consider thermal management for the BGA-260 package in enclosed environments.

Memory IC Part Context

Part of the SigmaQuad-IIIe family from GSI Technology. Designed for high-speed memory applications requiring low latency and high bandwidth. Uses advanced CMOS technology for performance efficiency.

Memory IC FAQ

What is the maximum operating frequency?

The maximum clock frequency is 675 MHz.

What is the data organization?

The device is organized as 8 Megwords by 36 bits.

GS82583ED36GK-675IGS82583ED36GK-675I
$622.94
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