Memory IC GS82583EQ36GK-500I product image

GS82583EQ36GK-500I

$622.94
  • Description:IC SRAM 288MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:acb954ff4474 Category: Brand:

  
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GS82583EQ36GK-500I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 260BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS82583EQ36GK-500I

  • Description:IC SRAM 288MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:288Mbit
  • Memory Organization:8M x 36
  • Memory Interface:Parallel
  • Clock Frequency:500 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.25V ~ 1.35V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:260-BGA
  • Supplier Device Package:260-BGA (22x14)
  • Access Time:-

Memory IC datasheet and documents for GS82583EQ36GK-500I

GS82583EQ36GK-500I

Memory IC Overview

The GS82583EQ36GK-500I is a 288 Mbit synchronous static random access memory (SRAM) manufactured by GSI Technology. It features an 8 M x 36 organization and operates with a maximum clock frequency of 500 MHz, corresponding to a 400 ps access time. The device utilizes a parallel interface and supports dual voltage supplies ranging from 1.25 V to 1.35 V. It is housed in a BGA-260 surface-mount package and is designed for industrial temperature operation between -40°C and +100°C.

Memory IC Feature Summary

  • Supports QDR-III storage technology for high-speed data handling
  • Features SigmaQuad-IIIe architecture for enhanced performance
  • Operates on low-voltage power supplies for efficiency

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure
  • Data center switching applications

Memory IC Procurement Notes

Verify the specific suffix codes against official GSI Technology documentation to ensure correct voltage and speed grades. Confirm package compatibility with PCB footprints prior to integration. Check for moisture sensitivity levels and reflow soldering profiles required for the BGA-260 package. Ensure supply chain sources provide valid traceability and authenticity guarantees for this specialized memory component.

Memory IC Selection Notes

Select this component when system requirements demand 500 MHz synchronous operation with a 36-bit wide data path. The dual-voltage capability allows flexibility in power domain design. Consider the BGA-260 footprint constraints and industrial temperature range suitability for harsh environments compared to commercial grade alternatives.

Memory IC Part Context

This part belongs to the GS82583 series of QDR-II/QDR-III SRAMs from GSI Technology. It represents a high-density solution within the company's portfolio, offering significant bandwidth for complex data processing tasks. The series is widely recognized in telecommunications and networking sectors for its reliability and speed.

Memory IC Replacement Considerations

Consult official GSI Technology substitution guides for compatible parts. Verify pinout and electrical parameter alignment before replacing existing inventory.

GS82583EQ36GK-500IGS82583EQ36GK-500I
$622.94
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