Memory IC GS82583ET18GK-675I product image

GS82583ET18GK-675I

$622.94
  • Description:IC SRAM 288MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:13c6b9e0cd69 Category: Brand:

  
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GS82583ET18GK-675I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 288MBIT PAR 260BGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS82583ET18GK-675I

  • Description:IC SRAM 288MBIT PAR 260BGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous
  • Memory Size:288Mbit
  • Memory Organization:16M x 18
  • Memory Interface:Parallel
  • Clock Frequency:675 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.25V ~ 1.35V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:260-BGA
  • Supplier Device Package:260-BGA (22x14)
  • Access Time:-

Memory IC datasheet and documents for GS82583ET18GK-675I

GS82583ET18GK-675I

Memory IC Overview

The GS82583ET18GK-675I is a static random access memory device manufactured by GSI Technology. It features a storage capacity of 288 Mbit organized as 16 M x 18 bits. The component supports a maximum clock frequency of 675 MHz and utilizes a parallel interface. Operating voltage ranges from 1.25 V to 1.35 V, with a maximum power supply current of 1.02 A. It is housed in a BGA-260 package suitable for surface mount technology. The device operates within a temperature range of -40 C to +100 C and belongs to the SigmaDDR-IIIe series.

Memory IC Feature Summary

  • Supports high-speed data transfer with a maximum clock frequency of 675 MHz
  • Utilizes DDR-III storage technology for efficient memory operations
  • Designed for wide industrial temperature operation ranging from -40 C to +100 C

Memory IC Applications

  • High-performance computing systems requiring fast memory access
  • Telecommunications infrastructure equipment
  • Network routing and switching applications

Memory IC Procurement Notes

Verify the specific ordering suffix and voltage specifications against the official manufacturer datasheet before procurement. Confirm that the BGA-260 package dimensions align with the target PCB footprint. Ensure compatibility with the required 1.25 V to 1.35 V power supply rails. Check for moisture sensitivity levels and appropriate handling procedures during assembly. Validate that the 675 MHz clock speed meets the system timing requirements.

Memory IC Selection Notes

Select this component when a 288 Mbit capacity with 18-bit width is required for parallel interface applications. Consider the 675 MHz maximum clock frequency for high-bandwidth needs. Evaluate the BGA-260 package constraints for board space limitations. Assess the power consumption profile relative to the 1.02 A maximum current draw. Ensure the operating temperature range suits the environmental conditions of the deployment.

Memory IC Part Context

This part belongs to the GS82583ET18GK series from GSI Technology. It is part of the SigmaDDR-IIIe product line, which focuses on high-speed synchronous SRAM solutions. The series typically offers various density and speed grades to support diverse embedded memory requirements in advanced electronic systems.

Memory IC FAQ

What is the organization of the memory array?

The memory array is organized as 16 M x 18 bits.

Is the device compatible with standard DDR-III voltages?

Yes, it operates within a voltage range of 1.25 V to 1.35 V.

GS82583ET18GK-675IGS82583ET18GK-675I
$622.94
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