Memory IC GS832136AGD-250I product image

GS832136AGD-250I

$36.13
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:1150778edc4a Category: Brand:

  
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GS832136AGD-250I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS832136AGD-250I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, Standard
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:Parallel
  • Clock Frequency:250 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS832136AGD-250I

GS832136AGD-250I

Memory IC Overview

The GS832136AGD-250I is a 36 Mbit Synchronous Burst Static Random Access Memory (SRAM) manufactured by GSI Technology. It features a memory organization of 1 Megabit by 36 bits and supports a maximum clock frequency of 250 MHz with an access time of 5.5 ns. The device operates on a single power supply voltage ranging from 2.3 V to 3.6 V, accommodating both 2.5 V and 3.3 V logic levels. It utilizes a parallel interface and is housed in a 165-ball Fine-Pitch Ball Grid Array (FPBGA) package measuring 15x13 mm. The component is rated for industrial operating temperatures between -40°C and +85°C.

Memory IC Feature Summary

  • Supports synchronous burst read operations with pipeline/flow-through architecture
  • Compatible with standard 2.5 V or 3.3 V power supplies
  • High-speed data transfer capability up to 250 MHz
  • Industrial temperature range operation for robust performance

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure systems
  • Industrial control applications requiring fast memory access

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the 165-FPBGA package dimensions match the design footprint. Ensure voltage requirements align with the 2.3 V to 3.6 V operational range. Check for moisture sensitivity labeling as indicated in official documentation.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required at high speeds. It serves as a direct replacement for other 1Mx36 SRAMs within the SyncBurst family. Consider the BGA package constraints for PCB layout. Verify that the system power supply remains within the specified 2.3 V to 3.6 V limits for reliable operation.

Memory IC Part Context

This part belongs to the GS832136AGD series of SyncBurst SRAMs. It shares architectural similarities with variants like the GS832132AGD-250I but offers a wider 36-bit data bus. The device is designed for applications demanding low latency and high throughput in synchronous environments.

Memory IC Replacement Considerations

Direct substitutes include other GS832136 variants with compatible packages and speed grades. Verify pin compatibility before replacing with similar 1Mx36 SRAMs from different manufacturers.

GS832136AGD-250IGS832136AGD-250I
$36.13
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