Memory IC GS832136AGD-333I product image

GS832136AGD-333I

$53.36
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:c0f6f6195188 Category: Brand:

  
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GS832136AGD-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS832136AGD-333I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, Standard
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS832136AGD-333I

GS832136AGD-333I

Memory IC Overview

The GS832136AGD-333I is a 36 Mbit Synchronous Burst Static Random Access Memory (SRAM) manufactured by GSI Technology. It features a memory organization of 1 Megabit by 36 bits and supports dual voltage operation at 2.5V or 3.3V, with a supply range from 2.3V to 3.6V. The device achieves a maximum clock frequency of 333 MHz with an access time of 4.5 ns. It utilizes a parallel interface and is available in a BGA-165 surface-mount package. Operating temperatures range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports synchronous burst read operations with pipeline/flow-through architecture
  • Compatible with both 2.5V and 3.3V power supplies for flexible system integration
  • High-speed data transfer capability up to 333 MHz clock frequency

Memory IC Applications

  • High-performance computing systems requiring fast cache memory
  • Network infrastructure equipment demanding high bandwidth
  • Industrial control systems operating in extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix 'GD' against the manufacturer's official datasheet to confirm pinout and electrical characteristics match your design requirements. Ensure that the BGA-165 package dimensions align with your PCB footprint. Confirm humidity sensitivity levels and reflow soldering profiles are compatible with your manufacturing process before finalizing procurement.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required alongside high-speed synchronous access. Compare the 4.5 ns access time against system timing constraints. Consider the BGA-165 package for space-constrained designs. Evaluate power consumption specifications under active load conditions relative to other SRAM options in the SyncBurst family.

Memory IC Part Context

This part belongs to the GS832136AGD series of SyncBurst SRAMs. It shares architectural similarities with other models in the lineup but differs in speed grade and package type. The '333' designation indicates the top-tier speed bin within this specific density and width configuration offered by GSI Technology.

Memory IC Replacement Considerations

Check for GS832136AD-333I as a potential alternative if package differences are acceptable. Verify compatibility with GS8321Z36AGD-333IV for ZBT variants, noting potential interface differences.

GS832136AGD-333IGS832136AGD-333I
$53.36
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