Memory IC GS8321Z36AGD-250I product image

GS8321Z36AGD-250I

$36.13
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:38fc9fd64dba Category: Brand:

  
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GS8321Z36AGD-250I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8321Z36AGD-250I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:Parallel
  • Clock Frequency:250 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8321Z36AGD-250I

GS8321Z36AGD-250I

Memory IC Overview

The GS8321Z36AGD-250I is a 36 Mbit synchronous Zero Bus Turnaround (ZBT) static random-access memory (SRAM) manufactured by GSI Technology. It features a parallel interface with an organization of 1M x 36 bits and supports maximum clock frequencies up to 250 MHz. The device operates within a voltage range of 2.3 V to 3.6 V, accommodating both 2.5 V and 3.3 V power supplies. It utilizes a 165-ball FBGA package for surface-mount installation and is rated for industrial temperature ranges from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via Zero Bus Turnaround technology to minimize bus turnaround latency
  • Provides flexible power supply compatibility for 2.5 V and 3.3 V systems
  • Features synchronous operation with a parallel interface for direct system integration

Memory IC Applications

  • High-performance embedded processing systems
  • Network infrastructure equipment requiring low-latency buffering
  • Industrial control applications demanding wide temperature stability

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the extended industrial temperature range (-40°C to +85°C). Confirm the package type matches the required 165-ball FBGA footprint on the target PCB. Ensure the design supports the specified 2.3 V to 3.6 V operating voltage window. Check for RoHS compliance documentation if environmental regulations apply to the final assembly.

Memory IC Selection Notes

Select this component when ZBT SRAM performance is required over standard synchronous SRAM due to reduced turnaround times. The 1M x 36 organization suits applications needing wide data paths without multiple chip cascading. Consider the 165-ball FBGA package constraints for board space and thermal management requirements in dense designs.

Memory IC Part Context

This part belongs to the GS8321 series of ZBT SRAMs from GSI Technology. It shares architectural similarities with other members like the GS8321Z36AGD-200 but offers higher speed capabilities at 250 MHz compared to the 200 MHz variant. The series is designed for high-throughput memory applications where bus efficiency is critical.

Memory IC Replacement Considerations

The GS8321Z36AGD-200 serves as a lower-speed alternative within the same family. Verify pinout and electrical characteristics before substitution, as speed grades differ. No direct cross-brand replacements are confirmed in public documentation.

GS8321Z36AGD-250IGS8321Z36AGD-250I
$36.13
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