Memory IC GS832236AGD-333I product image

GS832236AGD-333I

$53.36
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:9307a6f6f205 Category: Brand:

  
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GS832236AGD-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS832236AGD-333I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, Standard
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS832236AGD-333I

GS832236AGD-333I

Memory IC Overview

The GS832236AGD-333I is a 36 Mbit Synchronous Burst Static Random Access Memory (SRAM) manufactured by GSI Technology. It features a memory organization of 1M x 36 and supports parallel interface operations. The device operates with a maximum clock frequency of 333 MHz and offers an access time of 4.5 ns. Power supply requirements range from a minimum of 2.3 V to a maximum of 3.6 V, with maximum power currents specified at 290 mA and 400 mA. The component is housed in a BGA-165 package suitable for surface mount technology. It functions within a temperature range of -40°C to +85°C and utilizes Single Data Rate (SDR) storage type architecture.

Memory IC Feature Summary

  • Supports synchronous burst read/write operations with pipeline/flow-through architecture
  • Compatible with 2.5V or 3.3V logic levels for flexible system integration
  • Provides high-speed data transfer capabilities via parallel interface

Memory IC Applications

  • High-performance cache memory systems
  • Network infrastructure equipment
  • Telecommunications base stations
  • Industrial control systems requiring fast random access

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature grade compliance (-40°C to +85°C). Confirm the BGA-165 package dimensions match the target PCB footprint. Ensure voltage levels align with the 2.3V to 3.6V operating range. Check for moisture sensitivity labeling as indicated in specifications. Validate that the 333 MHz clock requirement is supported by the host system design.

Memory IC Selection Notes

Select this component when a 1M x 36 organization is required for wide data bus applications. Consider the 333 MHz speed grade for high-bandwidth synchronization needs. Evaluate the BGA-165 package constraints against available board space. Compare current consumption figures against thermal management capabilities. Ensure compatibility with existing 2.5V or 3.3V power rails in the design.

Memory IC Part Context

This part belongs to the GS8322 series of SyncBurst SRAMs from GSI Technology. It shares architectural similarities with other members like GS832136AGD-333I but differs in specific organizational parameters or package types within the broader family. The series is designed for applications demanding low latency and high throughput in synchronous environments.

Memory IC Replacement Considerations

GS832136AGD-333I: Similar speed and organization but verify package compatibility if pinout differs.

GS832236AGD-333IGS832236AGD-333I
$53.36
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