Memory IC GS8322Z36AGB-333I product image

GS8322Z36AGB-333I

$53.85
  • Description:IC SRAM 36MBIT PARALLEL 119FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:3ebacb9a2d31 Category: Brand:

  
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GS8322Z36AGB-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 119FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8322Z36AGB-333I

  • Description:IC SRAM 36MBIT PARALLEL 119FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:119-BGA
  • Supplier Device Package:119-FPBGA (22x14)
  • Access Time:-

Memory IC datasheet and documents for GS8322Z36AGB-333I

GS8322Z36AGB-333I

Memory IC Overview

The GS8322Z36AGB-333I is a 36 Mbit Synchronous Burst Static Random Access Memory (SRAM) manufactured by GSI Technology. It features a memory organization of 1M x 36 and supports a maximum clock frequency of 333 MHz with an access time of 4.5 ns. The device operates within a supply voltage range of 2.3 V to 3.6 V, drawing a maximum current of 280 mA or 365 mA depending on the specific operating condition. It utilizes a parallel interface and is housed in a 119-pin BGA package suitable for surface mount technology. The component is rated for an industrial temperature range from -40°C to +85°C.

Memory IC Feature Summary

  • Supports NBT (No Bus Turn Around) functionality enabling zero wait Read-Write-Read bus utilization
  • User-configurable Pipeline and Flow Through architecture modes
  • Includes IEEE 1149.1 JTAG-compatible Boundary Scan for testing
  • Features LBO pin support for Linear or Interleave Burst mode operation

Memory IC Applications

  • High-speed data buffering in telecommunications equipment
  • Cache memory implementation in network routers and switches
  • Data storage in industrial control systems requiring wide data buses
  • Embedded applications in automotive electronics with wide temperature requirements

Memory IC Procurement Notes

Verify the exact suffix 'I' corresponds to the industrial temperature grade (-40°C to +85°C) as specified in the official datasheet. Confirm that the 119-pin BGA footprint matches your PCB design constraints. Ensure power supply decoupling meets the high peak current demands indicated in the electrical specifications. Check for RoHS compliance status if required by your manufacturing standards.

Memory IC Selection Notes

Select this component when a wide 36-bit data path is necessary for high-throughput applications. The 333 MHz speed class offers a balance between performance and power consumption compared to faster variants. Consider the 119-BGA package size for space-constrained designs. Verify compatibility with existing system voltage levels, as the device supports a broad range from 2.3V to 3.6V.

Memory IC Part Context

This part belongs to the GS8322Z36AGB series of NoBL SRAMs from GSI Technology. These devices are designed to replace traditional ZBT and pipeline SRAMs while offering superior bus efficiency. The series includes various speed grades and package options, with the GB suffix indicating the 119-pin BGA form factor. It is part of a family pin-compatible with other densities in the same series.

Memory IC Replacement Considerations

Direct substitutes include other GS8322Z36AGB variants with different speed grades (e.g., -250IV, -200IV) if lower performance is acceptable. Ensure any replacement maintains the 119-pin BGA footprint and 1M x 36 organization. Verify that the alternative part supports the required industrial temperature range and voltage specifications.

GS8322Z36AGB-333IGS8322Z36AGB-333I
$53.85
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