Memory IC GS8322Z36AGD-333I product image

GS8322Z36AGD-333I

$53.85
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:72859f5d7e8f Category: Brand:

  
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GS8322Z36AGD-333I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8322Z36AGD-333I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Synchronous, ZBT
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:Parallel
  • Clock Frequency:333 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:2.3V ~ 2.7V, 3V ~ 3.6V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8322Z36AGD-333I

GS8322Z36AGD-333I

Memory IC Overview

The GS8322Z36AGD-333I is a 36 Mbit synchronous static random access memory (SRAM) organized as 1 Megabit by 36 bits. Manufactured by GSI Technology, this component operates with a maximum clock frequency of 333 MHz and features an access time of 4.5 ns. It utilizes a parallel interface and supports power supply voltages ranging from 2.3 V to 3.6 V. The device consumes a maximum current of 280 mA or 365 mA depending on operating conditions. Designed for industrial applications, it functions within a temperature range of -40°C to +85°C and is housed in a 119-pin BGA package.

Memory IC Feature Summary

  • Supports user-configurable Pipeline and Flow Through modes for flexible data handling
  • Includes ZQ mode pin for selectable high/low output drive strength
  • Features IEEE 1149.1 JTAG-compatible Boundary Scan for testing
  • Provides LBO pin support for Linear or Interleave Burst mode operations

Memory IC Applications

  • High-speed data buffering in telecommunications equipment
  • Cache memory implementation in network processing systems
  • Data storage in industrial control units requiring wide data buses

Memory IC Procurement Notes

Verify the specific suffix 'GD' against official manufacturer documentation to confirm the exact speed grade and package variant, as ordering codes may differ across distributors. Ensure the procurement channel provides valid RoHS compliance certificates and humidity sensitivity level information prior to purchase. Confirm that the supplier offers genuine components directly from GSI Technology or authorized channels to avoid counterfeit risks associated with high-frequency memory devices.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required alongside high throughput at 333 MHz. The 1M x 36 organization suits applications needing large word widths without external multiplexing. Consider the 119-pin BGA footprint for board space constraints. Verify that the system design accommodates the specified 2.3 V to 3.6 V supply range and that the thermal environment remains within the -40°C to +85°C industrial limits during operation.

Memory IC Part Context

This part belongs to the GS8322Z36A series of NBT SRAMs from GSI Technology. These devices are designed for high-performance embedded systems requiring zero wait-state Read-Write-Read bus utilization. The series typically includes variants with different access times and package options, such as the 165-pin BGA, to accommodate various density and form factor requirements in networking and computing hardware.

Memory IC Replacement Considerations

Check for other suffixes within the GS8322Z36AGD family, such as slower speed grades (e.g., -200), which may be pin-compatible but offer lower performance. Verify if the GS8322Z36AGB series serves as a direct alternative if package dimensions match exactly.

GS8322Z36AGD-333IGS8322Z36AGD-333I
$53.85
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