Memory IC GS8342D18BGD-300I product image

GS8342D18BGD-300I

$35.40
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:51c5b9981314 Category: Brand:

  
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GS8342D18BGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8342D18BGD-300I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:36Mbit
  • Memory Organization:2M x 18
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8342D18BGD-300I

GS8342D18BGD-300I

Memory IC Overview

The GS8342D18BGD-300I is a 36 Mbit Static Random Access Memory (SRAM) from GSI Technology, organized as 2 M x 18. It operates within a supply voltage range of 1.7 V to 1.9 V and supports a maximum clock frequency of 300 MHz. The device features a parallel interface and is housed in a BGA-165 package suitable for surface mount technology. It functions within an industrial temperature range of -40°C to +85°C and has a maximum power current consumption of 540 mA.

Memory IC Feature Summary

  • Supports high-speed data transfer with a maximum clock frequency of 300 MHz
  • Operates on dual voltage supplies of 1.8 V or 1.5 V
  • Designed for industrial temperature environments ranging from -40°C to +85°C

Memory IC Applications

  • High-performance networking equipment
  • Telecommunications infrastructure
  • Industrial control systems

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates the industrial temperature grade (-40°C to +85°C) compared to commercial variants. Confirm the BGA-165 package dimensions match your PCB footprint requirements. Ensure your system design accommodates the 540 mA maximum current draw at 300 MHz operation. Check RoHS compliance documentation for environmental regulations.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is required at speeds up to 300 MHz. The 2M x 18 organization suits applications needing wide data buses without complex bit-stitching. Consider the BGA-165 package for compact board layouts. Verify that the 1.7V to 1.9V operating range aligns with your power delivery network capabilities.

Memory IC Part Context

This part belongs to the SigmaQuad-II family of synchronous SRAMs from GSI Technology. These devices are engineered to maximize bus bandwidth utilization. The series offers various density and speed options, with this specific model providing a balance of moderate density and high-frequency performance in a standard industrial temperature range.

Memory IC FAQ

What is the difference between the GS8342D18BGD-300I and GS8342D18BGD-300?

The 'I' suffix denotes the Industrial temperature grade (-40°C to +85°C), whereas the non-suffixed version typically refers to the Commercial temperature grade (0°C to +70°C).

Does this device support single-voltage operation?

Yes, the datasheet specifies it can operate on either 1.8 V or 1.5 V supply voltages.

GS8342D18BGD-300IGS8342D18BGD-300I
$35.40
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