Memory IC GS8342D36BGD-300I product image

GS8342D36BGD-300I

$35.40
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:4ae54ef22fff Category: Brand:

  
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GS8342D36BGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8342D36BGD-300I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous
  • Memory Size:36Mbit
  • Memory Organization:1M x 36
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8342D36BGD-300I

GS8342D36BGD-300I

Memory IC Overview

The GS8342D36BGD-300I is a 36 Mbit Static Random Access Memory (SRAM) device from GSI Technology, organized as 1 M x 36. It operates within a supply voltage range of 1.7 V to 1.9 V and supports a maximum clock frequency of 300 MHz. The component utilizes a parallel interface and is housed in a BGA-165 package for surface mount installation. It belongs to the SigmaQuad-II series and features DDR storage technology. The industrial temperature rating spans from -40°C to +85°C, with a maximum power consumption of 685 mA.

Memory IC Feature Summary

  • Supports high-speed parallel data transfer at frequencies up to 300 MHz
  • Operates on low voltage supplies between 1.7 V and 1.9 V
  • Designed for industrial environmental conditions ranging from -40°C to +85°C

Memory IC Applications

  • High-performance embedded memory systems
  • Industrial control hardware requiring wide temperature tolerance
  • Data buffering in parallel interface architectures

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C). Confirm the BGA-165 package dimensions match the target PCB footprint. Ensure the 1.8V or 1.5V supply rails align with system power design. Check moisture sensitivity levels for proper handling during assembly.

Memory IC Selection Notes

Select this part when a 36-bit wide data path is required at 300 MHz speeds. Compare against other GS8342 variants if different organizations like 2Mx18 are needed. Ensure the board layout supports the BGA-165 thermal requirements. Validate that the 685 mA current draw fits the power budget constraints.

Memory IC Part Context

This component is part of the GS8342D36BGD family, which includes various speed grades and organizational options. It shares the same physical package and core architecture with other members like the GS8342S36BGD-300I, differing primarily in internal circuitry and feature sets defined by the manufacturer's product line strategy.

Memory IC Replacement Considerations

Direct substitutes include other GS8342D36BGD variants with compatible pinouts. Verify electrical compatibility before swapping with similar SRAM devices from other manufacturers.

GS8342D36BGD-300IGS8342D36BGD-300I
$35.40
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