GS8342D36BGD-400I

Memory IC Overview

The GS8342D36BGD-400I is a 36 Mbit Double Data Rate Static Random Access Memory (DDR SRAM) manufactured by GSI Technology. It features a 1 M x 36 organization and operates at a maximum clock frequency of 400 MHz. The device utilizes a parallel interface with a pipelined architecture for high-speed data transfer. Power requirements include a core voltage range of 1.7 V to 1.9 V and an HSTL interface voltage of 1.5 V or 1.8 V. Maximum power consumption reaches 780 mA. It supports byte write functions and is housed in a 165-bump BGA package suitable for surface mount applications.

Memory IC Feature Summary

• Supports simultaneous read and write operations via the SigmaCIO interface
• Features a fully coherent pipelined read and write architecture
• Includes programmable output drive strength through ZQ pin calibration

Memory IC Applications

• High-performance networking equipment requiring low latency memory
• Telecommunications infrastructure systems
• Industrial control systems demanding reliable data storage

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates industrial temperature rating compliance (-40 C to +85 C). Confirm the package type matches the required 165-bump BGA footprint on the target PCB. Ensure voltage levels align with the specified 1.5 V or 1.8 V HSTL interface requirements. Check moisture sensitivity level handling procedures during assembly.

Memory IC Selection Notes

Select this component when a 36-bit wide data path is necessary for system integration. The 400 MHz speed rating suits applications requiring high bandwidth throughput. Consider the 165-bump BGA package constraints for board layout density. Verify that the power supply design can accommodate the peak current draw of up to 780 mA during active operation.

Memory IC Part Context

This part belongs to the GS8342R36BGD series, which includes variants like GS8342R36BGD-400I. These devices are designed as pin-compatible solutions within the family, allowing for scalability across different speed grades while maintaining the same physical footprint and interface standards.

Memory IC Replacement Considerations

Compatible substitutes include other parts from the GS8342R36BGD series with matching speed grades. Ensure any replacement maintains the 1 M x 36 organization and 165-bump BGA package dimensions.