GS8342DT37BGD-400I

Memory IC Overview

The GS8342DT37BGD-400I is a synchronous static random access memory component manufactured by GSI Technology. It features a storage capacity of 36 Mbit organized as 1 M x 36 bits. The device supports a maximum clock frequency of 400 MHz with a parallel interface type. Operating voltage ranges from 1.7 V to 1.9 V, with a maximum power supply current of 780 mA. It operates within an industrial temperature range of -40°C to +85°C and is housed in a BGA-165 surface-mount package.

Memory IC Feature Summary

• Supports quad-port architecture for transferring four data beats per clock cycle
• Utilizes SigmaDDR-II+ technology for high-speed synchronous operation
• Compatible with 1.8V or 1.5V power supplies

Memory IC Applications

• High-performance networking equipment
• Telecommunications infrastructure
• Industrial control systems requiring wide temperature tolerance

Memory IC Procurement Notes

Verify the specific suffix 'I' indicates the extended industrial temperature range (-40°C to +85°C) compared to commercial variants. Confirm the BGA-165 package dimensions and pitch match the target PCB footprint. Ensure moisture sensitivity level handling procedures are followed during assembly due to humidity sensitivity classification.

Memory IC Selection Notes

Select this part when a 36-bit wide data path is required at speeds up to 400 MHz. The industrial grade rating makes it suitable for harsh environments where standard commercial parts may fail. Compare against other GS8342 series members if different speed grades or temperature ranges are needed.

Memory IC Part Context

This component belongs to the GS8342 series of SRAMs from GSI Technology. These devices are designed for applications demanding high bandwidth and low latency. The series includes various speed grades and organizational options to fit diverse system requirements.

Memory IC Replacement Considerations

Check for GS8342DT37BGD-400 (commercial temp) or GS8342TT38BGD-400I (similar specs) as potential alternatives depending on exact thermal and electrical constraints.