GS8342Q19BGD-357I

Memory IC Overview

The GS8342Q19BGD-357I is a 36Mb (37,748,736-bit) SigmaQuad-II+ SRAM manufactured by GSI Technology. It features a 2M x 18 organization with a maximum clock frequency of 357 MHz and a cycle time of 2.8 ns. The device operates on a 1.8 V core supply (VDD: 1.7 V to 1.9 V) and supports 1.5 V or 1.8 V HSTL I/O supplies (VDDQ). It utilizes a 165-bump BGA package (13 mm x 15 mm, 1 mm pitch) and includes On-Die Termination (ODT), programmable output drive strength via ZQ, and JTAG boundary scan compliance.

Memory IC Feature Summary

• Supports simultaneous read and write operations through the SigmaQuad interface optimized for alternating access patterns.
• Features dual double data rate (DDR) interface with fully coherent read and write pipelines.
• Includes On-Die Termination (ODT) on Data, Byte Write, and Clock inputs for signal integrity.
• Provides programmable output impedance control via the ZQ pin and byte-level write masking capabilities.

Memory IC Applications

• High-performance networking systems requiring low power and high speed.
• Applications necessitating separate input/output SRAM architectures.
• Systems utilizing JEDEC-standard pinout and package configurations.

Memory IC Procurement Notes

Verify that the specific part number suffix corresponds to the required temperature range and voltage specifications. Confirm compatibility with the host system's clocking scheme and address mapping requirements. Ensure proper termination resistor values are selected for the ZQ pin to achieve desired output impedance levels. Validate power-up sequencing protocols to maintain DLL lock stability.

Memory IC Selection Notes

Select this component for designs requiring a 2M x 18 memory configuration with high-speed synchronous operation. Consider the 165-bump BGA package constraints for PCB layout and thermal management. Evaluate the need for ODT and programmable drive strength based on trace length and signal integrity requirements. Ensure the system supports the specified HSTL I/O standards and voltage levels.

Memory IC Part Context

This device belongs to the SigmaQuad-II+ family of Separate I/O synchronous SRAMs. It is designed to provide economical high-performance memory solutions for networking applications. The family shares common architectural features such as pipelined reads and DDR interfaces, differing primarily in data width and speed grades.

Memory IC Replacement Considerations

Compatible substitutes within the same family include GS8342Q07BGD-357I, GS8342Q10BGD-357I, and GS8342Q37BGD-357I, which share identical pinouts and core functionality but differ in data bus width.

Memory IC FAQ

How is the output driver impedance controlled?

Output impedance is programmed via the ZQ pin connected to VSS through an external resistor RQ. The value of RQ must be 5 times the desired RAM output impedance, typically between 175Ω and 350Ω.

What is the function of the ODT pin?

The ODT pin enables or disables On-Die Termination for Data, Byte Write, and Clock inputs. When tied High, termination is enabled; when Low or floating, it is disabled.

Can the K and K clock inputs be left floating?

No, K and K cannot be set to VREF voltage or left floating. They must be driven by valid clock signals to ensure proper operation and avoid metastability.