Memory IC GS8342T18BGD-300I product image

GS8342T18BGD-300I

$35.40
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:3008f699de47 Category: Brand:

  
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GS8342T18BGD-300I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8342T18BGD-300I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, DDR II
  • Memory Size:36Mbit
  • Memory Organization:2M x 18
  • Memory Interface:Parallel
  • Clock Frequency:300 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (15x13)
  • Access Time:-

Memory IC datasheet and documents for GS8342T18BGD-300I

GS8342T18BGD-300I

Memory IC Overview

The GS8342T18BGD-300I is a 36 Mbit Static Random Access Memory (SRAM) device manufactured by GSI Technology. It features a memory organization of 2 M x 18 bits and operates with a maximum clock frequency of 300 MHz. The component utilizes a parallel interface and supports dual voltage supplies of 1.8 V or 1.5 V, with an operating range from 1.7 V to 1.9 V. Maximum power consumption current is specified at 460 mA. The device is housed in a BGA-165 package suitable for surface mount technology (SMD/SMT). It functions as a DDR SRAM within the SigmaDDR-II B2 series and maintains an access time of 450 ps across an industrial temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports dual voltage operation at 1.8 V or 1.5 V for flexible system integration
  • Utilizes a pipelined architecture for high-speed data processing
  • Provides separate I/O interfaces for efficient signal management

Memory IC Applications

  • High-performance networking equipment requiring fast data buffering
  • Telecommunications infrastructure systems
  • Industrial control applications demanding wide temperature stability

Memory IC Procurement Notes

Verify the specific ordering suffix and package variant against the manufacturer's official datasheet to ensure compatibility with design requirements. Confirm RoHS compliance status and humidity sensitivity handling procedures prior to assembly. Cross-reference the part number with authorized distributors to validate authenticity and supply chain integrity. Ensure that the selected voltage configuration matches the target system specifications.

Memory IC Selection Notes

Select this component when a 36 Mbit capacity with a 18-bit word width is required for parallel data paths. The 300 MHz clock speed and 450 ps access time make it suitable for latency-sensitive digital signal processing tasks. Consider the BGA-165 footprint and SMD mounting style for PCB layout constraints. Evaluate the 460 mA maximum current draw against the system's power budget and thermal dissipation capabilities.

Memory IC Part Context

This part belongs to the GS8342T18BGD series, which represents GSI Technology's SigmaDDR-II family of synchronous static random access memories. These devices are designed for embedded solutions where high bandwidth and low latency are critical. The series offers various organizational options and clock speeds to accommodate different performance tiers in memory-intensive electronic designs.

Memory IC Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify functional equivalence with other members of the GS8342 series, such as the GS8342R08BGD-300I, only if pinout and electrical parameters align exactly.

GS8342T18BGD-300IGS8342T18BGD-300I
$35.40
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