Memory IC GS8342T18BGD-400I product image

GS8342T18BGD-400I

$50.27
  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray

SKU:d54c5af92c38 Category: Brand:

  
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GS8342T18BGD-400I is listed in the Memory IC range at ChipApex. The manufacturer field lists GSI Technology Inc.. Its product description is IC SRAM 36MBIT PARALLEL 165FPBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for GS8342T18BGD-400I

  • Description:IC SRAM 36MBIT PARALLEL 165FPBGA
  • Series:-
  • Mfr:GSI Technology Inc.
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:SRAM
  • Technology:SRAM - Quad Port, Synchronous, DDR II
  • Memory Size:36Mbit
  • Memory Organization:2M x 18
  • Memory Interface:Parallel
  • Clock Frequency:400 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:1.7V ~ 1.9V
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:165-LBGA
  • Supplier Device Package:165-FPBGA (13x15)
  • Access Time:-

Memory IC datasheet and documents for GS8342T18BGD-400I

GS8342T18BGD-400I

Memory IC Overview

The GS8342T18BGD-400I is a synchronous static random-access memory (SRAM) device manufactured by GSI Technology. It features a storage capacity of 36 Mbit organized as 2M x 18 bits. The component supports dual voltage operation at 1.8V or 1.5V, with a maximum operating frequency of 400 MHz. It utilizes a parallel interface and is housed in a BGA-165 package suitable for surface mount technology. The industrial temperature range spans from -40°C to +85°C.

Memory IC Feature Summary

  • Supports high-speed data transfer via a parallel interface architecture
  • Operates on flexible power supply options including 1.8V and 1.5V levels
  • Designed for robust performance within an extended industrial temperature range

Memory IC Applications

  • High-performance embedded systems requiring fast memory access
  • Industrial control units operating in extreme environmental conditions
  • Telecommunications infrastructure equipment needing reliable data buffering

Memory IC Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature grade (-40°C to +85°C) against the manufacturer's official datasheet. Ensure the BGA-165 footprint matches your PCB design constraints. Confirm RoHS compliance status through current documentation before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 36 Mbit density with a 18-bit word width is required. The 400 MHz clock speed suits applications demanding high bandwidth. Consider the BGA-165 package size for space-constrained designs. Verify that the system power rails support both 1.8V and 1.5V operations for optimal flexibility.

Memory IC Part Context

This part belongs to the GS8342 series of synchronous SRAMs from GSI Technology. These devices are engineered for high-density memory solutions. The series typically includes various organization options and speed grades. This specific model represents a mid-range density option within the broader portfolio of high-speed memory components.

Memory IC Replacement Considerations

Check for other GS8342 variants with compatible pinouts but different densities or speeds. Verify if alternative manufacturers offer equivalent 36 Mbit 18-bit SRAMs in BGA-165 packages. Ensure any substitute maintains the same voltage and temperature specifications.

GS8342T18BGD-400IGS8342T18BGD-400I
$50.27
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